Custom China FPC and Flexible PCB Circuit Board Manufacture with Double-Sided PCB Supplier for Hot Selling Fr4 PCB Main Control Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-20.00 / Piece

Sepcifications

  • Structure Single-Sided FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Abis
  • Transport Package Vocuum Packing
  • Specification 100*15 mm
  • Trademark Abis
  • Origin Shenzhen, China

Product Description

ABIS CIRCUITS CO., LTD Briefly introduce our strengths: 1. A professional PCB manufacturer which was established on Oct, 2006 2. Focusing on double side, Multilayer and HDI pcb mass production 3. Two factories, one for small and middle volume orders, another for big volume and HDI ...

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PCB Comparison
Transaction Info
Price US $ 0.10-20.00/ Piece US $ 0.25-5.60/ Piece US $ 0.25-3.60/ Piece US $ 0.68-2.27/ pieces US $ 0.68-2.27/ pieces
Min Order 1 Pieces 1 Pieces 1 Pieces 5 pieces 5 pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal T/T, Western Union, Paypal, Wechat/Alipay T/T, Western Union, Paypal, Wechat/Alipay
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe - -
Annual Export Revenue US$50 Million - US$100 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model OEM OEM, ODM, Own Brand(KMC) OEM, ODM, Own Brand(KMC) - -
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- -
Product Attributes
Specification
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Abis;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kmc;
Service Mode: OEM;
Production Mode: SMT;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kmc;
Service Mode: OEM;
Production Mode: SMT;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Picopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Surface Finishing: Enig, Immersion Silver, OSP;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Picopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Surface Finishing: Enig, Immersion Silver, OSP;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier