Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Eng Thickness: 1-3u;
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 5-50u;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Item No: PCB Assembly;
Place of Origin: China;
Service: One Stop Service;
Material: Fr4 Cem1 Hight Tg, FPC, Alum;
Testing: PCB Test, PCBA Function Test, Aoi Test;
Layer: 1-48;
Copper Thickness: 1oz, 2oz, 3oz;
Board Type: Rigid PCBA, Filexible PCBA, Metal PCBA, Gold Plate;
Surface Finish: HASL, Enig, Immersion Gold, Immersion Silver;
Funtion Test: 100 % Functional Test;
PCBA Testing: X-ray, Aoi Test, Functional Test;
PCBA Color: Green, White, Black, Red, Blue;
Application: Electronics Device;
Testing Service: 100%;
Board Thickness: 0.2mm-7.0mm;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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