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What is Fast Charger PCBA Service Rigid-Flex Printed Circuit Board SMT&DIP for Electronics

Name: Fast Charger PCBA Service Rigid-Flex Printed Circuit Board SMT&DIP for Electronics
Uploaded: 2023-09-20T18:53:13+08:00
Description: Fast Charger PCBA Service Rigid-Flex Printed Circuit Board SMT&DIP for Electronics Company Brief Introduction Abis Circuits Co. Ltd, established in 2006, is Located in Shenzhen, the company has

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Price

Min. Order Reference FOB Price

1 Piece US$0.01-1.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Fr4
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification 140*110mm
Trademark ABIS CIRCUITS
Origin Shenzhen, China
Copper Thickness 1 Oz
Board Layer 1-20 Layers
Board Thickness 1.6mm
Surface Finish Gold Plating, Enig
Solder Mask Green/Custom
Legend White

Product Description

Fast Charger PCBA Service Rigid-Flex Printed Circuit Board SMT&DIP for Electronics Company Brief Introduction Abis Circuits Co. Ltd, established in 2006, is Located in Shenzhen, the company has about 1100 workers and two PCB workshops with about 50000 square meters. Our products are ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

PCB Comparison

	Quick View Fast Charger PCBA Service Rigid-Flex Printed Circuit Board SMT&DIP for Electronics Contact Now	Quick View 2 Layers Solid High and Low Copper Special PCB Contact Now	Quick View 3mil Circuit Line Enig Board PCB for Medical Monitor Main Board Contact Now	8mil BGA Enig Printed Circuit Board PCB for X-ray Detector Contact Now	Quick View Immersion Gold Circuit Board Motherboard PCB for Gastroscope Detector Contact Now

Transaction Info
	Quick View Fast Charger PCBA Service Rigid-Flex Printed Circuit Board SMT&DIP for Electronics Contact Now	Quick View 2 Layers Solid High and Low Copper Special PCB Contact Now	Quick View 3mil Circuit Line Enig Board PCB for Medical Monitor Main Board Contact Now	8mil BGA Enig Printed Circuit Board PCB for X-ray Detector Contact Now	Quick View Immersion Gold Circuit Board Motherboard PCB for Gastroscope Detector Contact Now
Price	US $ 0.01-1.00/ Piece	US $ 0.18-0.98/ Piece	US $ 1.29-5.48/ Piece	US $ 1.18-5.24/ Piece	US $ 1.02-3.27/ Piece
Min Order	1 Pieces	1 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Abis; Copper Thickness: 1 Oz; Board Layer: 1-20 Layers; Board Thickness: 1.6mm; Surface Finish: Gold Plating, Enig; Solder Mask: Green/Custom; Legend: White;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Special PCB: Special PCB;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 12L up to 20L; Board Thickness: 2.4mm up to 8mm; Min Hole Size: 0.3mm; Min. Trace/Space: 4mil; Finished Copper: 1/1 Oz;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 12L up to 20L; Board Thickness: 2.4mm up to 8mm; Min Hole Size: 0.3mm; Min. Trace/Space: 4mil; Finished Copper: 1/1 Oz;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 4L up to 20L; Board Thickness: 1.6mm up to 8mm; Min Hole Size: 0.3mm; Min. Trace/Space: 4mil; Finished Copper: 1/1 Oz;
Supplier Name	Abis Circuits Co., Ltd.	China Dragon Electronic Industrial Co., Limited	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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