Rigid-Flex PCB
US$0.01-10.00 / Piece
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What is China Polyimide/Pi and Fr4 Material PCB Board FPC/Rigid-Flex Electronics Circuits Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-10.00 / Piece

Sepcifications

  • Insulation Materials Epoxy Resin
  • Flame Retardant Properties V0
  • Application Industry Area
  • Transport Package Vacuum Packing
  • Specification 260*240
  • Trademark Abis
  • Origin Made in China
  • Layer 1-2 Layers
  • Common Finish Board Thickness 0.3-5mm
  • Raw Material Aluminum Base, Copper Base
  • Min Line Width/Space 3mil(0.075mm)
  • Impedance Control Tolerance +/-10%
  • Surface Finishing Lead Free HASL, Immersion Gold(Enig), Immersion SL

Product Description

China Polyimide/PI and FR4 Material PCB Board FPC/Rigid-Flex Electronics Circuits Board Technical &Capability Item Speci. Layers 1~8 Board Thickness 0.1mm-0.2mm Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz) Constantan ...

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Rigid-Flex PCB Comparison
Transaction Info
Price US $ 0.01-10.00/ Piece US $ 1.20-3.68/ Piece US $ 0.15-0.36/ Piece US $ 5.66-7.83/ Piece US $ 0.65-3.15/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Product Certification - RoHS UL - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Industry Area;
Layer: 1-2 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Surface Finishing: Lead Free HASL, Immersion Gold(Enig), Immersion SL;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.1mm;
Min Trace: 0.15mm;
Surface Finishing: Enig;
Solder Mask: Any;
Lead Time: 4-5 Working Days;
Test: 100%;
Service: One-Stop;
Packaging: Vacuum + Carton;
Payment: T/T, Paypal, Western Union;
Insulation Materials: Organic Resin;
Flame Retardant Properties: HB;
Application: Aerospace;
Board Material: Fr4 and Polyimide;
Board Layer: 1-26 Layers;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Max PCB Size: 650*650mm;
Testing: 100%;
Packaging: Carton + Vacuum;
Board Shape: Rectangular ; Round ;Slots and Cut Outs; Complex a;
BGA-Min Pitch: 0.25mm;
PCB Service: One Stop Service;
Dielectric: Fr4 and Polyimide;
Application: Communication;
Board Material: Fr4 and Polyimide;
Board Layer: 1-26 Layers;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Lead Time: 5-6 Working Days;
Max PCB Size: 650*650mm;
Testing: 100%;
Packaging: Carton + Vacuum;
Board Shape: Rectangular ; Round ;Slots and Cut Outs; Complex a;
BGA-Min Pitch: 0.25mm;
PCB Service: One Stop Service;
Dielectric: Fr4 and Polyimide;
Board Material: Fr4 and Polyimide;
Board Layer: 1-26 Layers;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Lead Time: 5-6 Working Days;
Max PCB Size: 650*650mm;
Testing: 100%;
Packaging: Carton + Vacuum;
Board Shape: Rectangular ; Round ;Slots and Cut Outs; Complex a;
BGA-Min Pitch: 0.25mm;
PCB Service: One Stop Service;
Dielectric: Fr4 and Polyimide;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier