Multilayer PCB Immersion Gold Printed Circuits Boards Gold Finger pictures & photos

Multilayer PCB Immersion Gold Printed Circuits Boards Gold Finger

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Price

Min. Order Reference FOB Price

1 Piece US$0.01-150.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum Packing
Specification Custom
Trademark ABIS CIRCUITS CO., LTD
Origin Shenzhen, China
Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
Copper Thickness 0.5-8oz
Eng Thickness 1-3u
Board Thickness 0.2-6mm
Hard Gold Thickness 5-50u
Certification UL, ISO9001&ISO14001, SGS, RoHS, Ts16949

Product Description

ABIS: One-Stope Service from PCB fabricate to PCB assembly Company profile Why Chose us High-end euipment-high speed Pick and Place Machines that can process about 25,000 SMD components per hour High efficient supply ability 60K Sqm monthly-Offers low volume and on-demand PCB ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

Polymide Comparison

	Multilayer PCB Immersion Gold Printed Circuits Boards Gold Finger Contact Now	Multilayer PCB Built on High CTI Fr-4 with Non-Conductive Via Fill Contact Now	Metal Core PCB Built on Aluminum Base with Black Solder Mask Contact Now	Metal Core PCB Built on Aluminum Base with White Mask and Immersion Gold Contact Now	Metal Core PCB Built on Aluminum Base with Mirror Reflection Contact Now

Transaction Info
	Multilayer PCB Immersion Gold Printed Circuits Boards Gold Finger Contact Now	Multilayer PCB Built on High CTI Fr-4 with Non-Conductive Via Fill Contact Now	Metal Core PCB Built on Aluminum Base with Black Solder Mask Contact Now	Metal Core PCB Built on Aluminum Base with White Mask and Immersion Gold Contact Now	Metal Core PCB Built on Aluminum Base with Mirror Reflection Contact Now
Price	US $ 0.01-150.00/ Piece	US $ 9.99/ Piece	US $ 9.99/ Piece	US $ 9.99/ Piece	US $ 9.99/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	UL, ISO9001&ISO14001, SGS, RoHS, Ts16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million
Business Model	OEM	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Copper Thickness: 0.5-8oz; Eng Thickness: 1-3u; Board Thickness: 0.2-6mm; Hard Gold Thickness: 5-50u;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lf; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lf; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lf; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd
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