High Density Interconnect (HDI) Bare Board Multilayer Layer OEM Custom PCB with Half Holes

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-100.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Kb
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification Custom
  • Trademark Abis Circuits
  • Origin Shenzhen, China
  • Certification UL,ISO9001&ISO14001,SGS,RoHS,Ts16949
  • Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
  • Board Thickness 0.2-6mm
  • Copper Thickness 0.5-8oz

Product Description

High Density Interconnect(HDI) Bare Board Multilayer Layer OEM Custom PCB With Half holes ABIS CIRCUITS CO., LTD is a professional PCB manufacturer which is focus on double side, Multilayer and HDI pcb mass production. The company was established on 2006, We have two factories together(audited by ...

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Printed Circuit Board Comparison
Transaction Info
Price US $ 0.10-100.00/ Piece Negotiable US $ 1.00-9.90/ Square Meter US $ 0.10-0.90/ Square Meter US $ 2.00-5.00/ Piece
Min Order 1 Pieces 5 Pieces 1 Square Meters 1 Square Meters 1 Pieces
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, Paypal L/C, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification UL,ISO9001&ISO14001,SGS,RoHS,Ts16949 - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 - ISO 9001 ISO 9001 -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe -
Annual Export Revenue US$50 Million - US$100 Million - US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM - OEM, ODM, Own Brand() OEM, ODM, Own Brand() -
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- Off Season Lead Time: 1-3 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months
Peak Season Lead Time: 1-3 months
-
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Type: Standard;
Dielectric: Standard;
Material: Standard;
Application: Standard;
Flame Retardant Properties: Standard;
Mechanical Rigid: Standard;
Processing Technology: Standard;
Base Material: Standard;
Insulation Materials: Standard;
Brand: Ckmcu;
Sku: 10A058;
Place of Origin: China;
MOQ: 5;
Delivery Time: 7days;
Support Customization: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hemeil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Finestpcb;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chipskey Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Audited Supplier

Finest Printed Circuit Board Ltd.

Diamond Member Audited Supplier