Specification |
Structure: Multilayer FPC;
Material: Polyimide/Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Consumer Electronics,Electronics Device;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer: 1-8L;
Surface Finishing: Enig, HASL, Lf-HASL,;
Board Thickness: 1~4 mm;
Copper Thickness: 1oz/2oz;
Solder Mask Color: Green Black Red,Black.Red.Yellow.White.Blue.Green;
Service: One-Stop Service,24hours Technical Services;
Min. Line Spacing: 0.003",0.15mm,0.05 mm;
Min. Hole Size: 0.25mm,0.1mm,6mil;
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Structure: Rigid-Flex;
Material: Copper;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow, Green;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Soler Mask Allignment Tolerance: 4mil;
Silkscreen Alignment Tolerance: 6mil;
Layer Structure: 4+4;
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Structure: Double-Sided FPC;
Material: Copper;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Hearing Aid;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4mm (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Tiny Solder Pad: 0.12mm;
Package Method: Special Half-Cut Array Package Deign for Customer;
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Structure: Double-Sided FPC;
Material: Copper;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Hearing Aid;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4mm (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Tiny Solder Pad: 0.12mm;
Package Method: Special Half-Cut Array Package Deign for Customer;
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Structure: Single-Sided FPC;
Material: Copper;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Hearing Aid;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4mm (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Tiny Solder Pad: 0.12mm;
Package Method: Special Half-Cut Array Package Deign for Customer;
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