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Multilayer Circuit Board PCB Clone

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-80.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Kb
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification Custom
Trademark Abis Circuits
Origin Shenzhen, China
Certification UL, ISO9001&ISO14001, SGS, RoHS Report
Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
Board Thickness 0.2-8mm
Copper Thickness 0.5-10oz

Product Description

Multilayer Circuit Board PCB Clone ABIS CIRCUITS CO., LTD is a professional PCB manufacturing which is focus on double side, Multilayer and HDI pcb mass production. The company was established on 2006, We have two factories together(audited by UL,ISO9001/14001,SGS,RoHS report) ,And all products ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

Multilayer Circuit Board Comparison

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Transaction Info
	Multilayer Circuit Board PCB Clone Contact Now	Quick View Enig Fr4 High Tg Multilayer PCB Boards, HDI Printed Circuit Board Contact Now	Quick View Multilayer Enig & HASL PCB Circuit Board with High Quality Contact Now	Quick View Multilayer Enig HASL PCB Circuit Board Manufacturing Rigid PCB with High Quality Contact Now	Quick View Induction Cooker Power PCB with Multilayer Design for Improved Efficiency Contact Now
Price	US $ 0.10-80.00/ Piece	US $ 0.50-8.50/ Piece	US $ 2.50-7.50/ Piece	US $ 0.50-8.50/ Piece	US $ 0.01-0.08/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, Paypal
Quality Control
Product Certification	UL, ISO9001&ISO14001, SGS, RoHS Report	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$50 Million - US$100 Million
Business Model	OEM	OEM, ODM, Own Brand(KMC)	OEM, ODM, Own Brand(KMC)	OEM, ODM, Own Brand(KMC)	OEM, ODM, Own Brand()
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-8mm; Copper Thickness: 0.5-10oz;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lead-Free; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 3mil/4mil; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lead-Free; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 3mil/4mil; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lead-Free; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 3mil/4mil; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;
Supplier Name	Abis Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.
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