2022 High Quality FPCB Production Quick Turn Flex Circuits Polyimide PCB Flexible Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 pcs US$0.01-50.00 / pcs

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 240*200
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Shenzhen, China
  • Board Thickness 0.2mm
  • Layers 1-8 Layers
  • Copper Thickness 35 Um
  • Surface Finish Enig

Product Description

2022 High Quality FPCB Production Quick Turn Flex Circuits Polyimide PCB Flexible Circuit Board Technical &Capability Item Speci. Layers 1~8 Board Thickness 0.1mm-0.2mm Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz) ...

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FPCB Comparison
Transaction Info
Price US $ 0.01-50.00/ pcs US $ 0.1/ Piece US $ 0.80-1.20/ Piece US $ 0.1/ Piece US $ 0.80-1.20/ Piece
Min Order 1 pcs 1000 Pieces 1 Pieces 1000 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$5 Million - US$10 Million US$10 Million - US$50 Million US$5 Million - US$10 Million US$10 Million - US$50 Million
Business Model OEM OEM, ODM, Own Brand() OEM, ODM, Own Brand(KMC) OEM, ODM, Own Brand() OEM, ODM, Own Brand(KMC)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.2mm;
Layers: 1-8 Layers;
Copper Thickness: 35 Um;
Surface Finish: Enig;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Antenk;
Number of Contacts: 20pins;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Antenk;
Number of Contacts: 6pins;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Antenk Electronics Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier

Antenk Electronics Co., Ltd.

Diamond Member Audited Supplier

Keep Moving Circuits Co., Ltd.

Diamond Member Audited Supplier