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US$0.10-50.00 / piece
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What is Alu/Fr4/Cem1/Cem3/Flexible LED PCB and PCBA for LED Lighting Module and LED Driver

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 piece US$0.10-50.00 / piece

Sepcifications

  • Structure Metal Base Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application LED
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Additive Process
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 240*200
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Shenzhen, China
  • Combination Mode Adhesive Flexible Plate
  • Conductive Adhesive Conductive Silver Paste

Product Description

ABIS CIRCUITS CO., LTD Created in 2006,as a long history China based PCB supplier, ABIS manufactures different kinds of printed circuit boards, including MCPCB,CEM-1,CEM-3,and FR4,FR-4 high Tg, Rogers, Teflon, Arlon ets special material. ABIS has set up two PCB factories in China: one for MCPCB ...

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PCB Comparison
Transaction Info
Price US $ 0.10-50.00/ piece US $ 0.912-2.49/ Piece US $ 2.51-6.27/ Piece US $ 3.64-7.23/ Piece US $ 1.97-4.83/ Piece
Min Order 1 piece 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Payment Terms T/T, Western Union, Paypal, 30 days net T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: LED;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: HASL-Lf;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 10L;
Min. Hole to Line: 6mil;
Inner Core Material: 0.2mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: HASL-Lf;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 10L;
Min. Hole to Line: 6mil;
Inner Core Material: 0.2mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: HASL-Lf+Gold Fingers;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 10L;
Min. Hole to Line: 9mil;
Inner Core Material: 0.2mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Immersion Gold;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 10L;
Min. Hole to Line: 7mil;
BGA to Line: 3.9mil;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier