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Blue Mask Multilayer Circuit Board HDI PCB China Motherboard 0.4mm Half Plating pictures & photos

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What is Blue Mask Multilayer Circuit Board HDI PCB China Motherboard 0.4mm Half Plating

Name: Blue Mask Multilayer Circuit Board HDI PCB China Motherboard 0.4mm Half Plating
Uploaded: 2023-10-18T18:34:42+08:00
Description: Blue Mask Multilayer Circuit Board HDI PCB China Motherboard 0.4mm Half Plating About US Abis Circuits Co., Ltd is a professional PCB manufacturer that was established in Oct 2006 and

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.01-1.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification 200*100mm
Trademark ABIS CIRCUITS CO., LTD
Origin Shenzhen, China
Board Thickness 1.0-5.00mm
Copper Thickness 2oz
Surface Finish Immersion Gold
Solder Mask Blue
Legend White/Customized

Product Description

Blue Mask Multilayer Circuit Board HDI PCB China Motherboard 0.4mm Half Plating About US Abis Circuits Co., Ltd is a professional PCB manufacturer that was established in Oct 2006 and focuses on double-side, Multilayer and HDI pcb mass production. We have two ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

PCB Comparison

	Quick View Blue Mask Multilayer Circuit Board HDI PCB China Motherboard 0.4mm Half Plating Contact Now	Quick View Enig Impedance Control PCB BGA to Line 3.5mil 8layer Circuit Board PCB Contact Now	Quick View 1.5mm Enig Min. Trace Line&Space 3.9mil 8layer PCB for Router/Modem/Switch Contact Now	Quick View Min. Hole to Line 7mil Inner Core Material 0.2mm HASL 8layer PCB for Industrial Power Supply Contact Now	Quick View Printing Circuit Board Fast Prototype PCB 94V0 Circuit Board Manufacturer and PCBA Supplier Contact Now

Transaction Info
	Quick View Blue Mask Multilayer Circuit Board HDI PCB China Motherboard 0.4mm Half Plating Contact Now	Quick View Enig Impedance Control PCB BGA to Line 3.5mil 8layer Circuit Board PCB Contact Now	Quick View 1.5mm Enig Min. Trace Line&Space 3.9mil 8layer PCB for Router/Modem/Switch Contact Now	Quick View Min. Hole to Line 7mil Inner Core Material 0.2mm HASL 8layer PCB for Industrial Power Supply Contact Now	Quick View Printing Circuit Board Fast Prototype PCB 94V0 Circuit Board Manufacturer and PCBA Supplier Contact Now
Price	US $ 0.01-1.00/ Piece	US $ 0.275-3.60/ Piece	US $ 0.265-3.55/ Piece	US $ 0.223-3.15/ Piece	US $ 0.80-6.00/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram, WeChat/Alipay
Quality Control
Product Certification	-	-	-	-	RoHS, UL Ce, GS
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 14001, ISO 20000, IATF16949, ISO 14064
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.0-5.00mm; Copper Thickness: 2oz; Surface Finish: Immersion Gold; Solder Mask: Blue; Legend: White/Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Other: Impedance Control; BGA to Line: 3.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Min. Trace Line&Space: 3.9mil; Inner Core Material: 0.1mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Min. Hole to Line: 7mil; Inner Core Material: 0.2mm;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Spectail: Impedance Control;
Supplier Name	Abis Circuits Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Topfast (Guangdong) Technology Co., Ltd.
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