Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: N/a;
Cooper Thickness: 1oz;
Surface Finishing: Immersion Gold 2u'';
Solder Mask Color: Green;
Silkscreen: White;
Min Line Width/Space: 0.15mm/0.2mm;
Min Hole Diameter: 0.2mm;
Finished Board Thickness: 1.2 mm;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Flame Retardant Properties: Other;
Mechanical Rigid: Other;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Other;
Board Thickness: 1.6mm;
PCB Max Panel Size: 1190*350mm/450*450mm;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Flame Retardant Properties: Other;
Mechanical Rigid: Other;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Other;
Board Thickness: 1.6mm;
PCB Max Panel Size: 1190*350mm/450*450mm;
|
Dielectric: FR-4;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Board Layer: 4 Layer;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Flame Retardant Properties: Other;
Mechanical Rigid: Other;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Other;
Board Thickness: 1.6mm;
PCB Max Panel Size: 1190*350mm/450*450mm;
|