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US$0.01-0.20 / Piece

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What is Mpu-2fk Main Board, Induction Furnace PCB Multilayer Circuit Board

Name: Mpu-2fk Main Board, Induction Furnace PCB Multilayer Circuit Board
Uploaded: 2022-07-20T19:58:20+08:00
Description: MPU-2FK Main Board, Induction Furnace PCB Multilayer Circuit Board Technical & Capability 1 Layer 1-20 layers 2 Material FR-4(High TG),Aluminum base,Polyimide,CEM-1,CEM-3, Rogers,FR4 halogen free,TEFL

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.01-0.20 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Delay Pressure Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Abis
Transport Package Vacuum Packing
Specification 182mm*145mm
Origin China
Test Flying Probe and Fixture
Solder Mask Green
Board Thickness 0.8mm / 1.6mm Custom
Custom OEM / ODM
Copper 0.5oz / 18um, 2oz / 70um
Layers 4 Layers, 6 Layers, 8 Layers, Custom
Legend White

Product Description

MPU-2FK Main Board, Induction Furnace PCB Multilayer Circuit Board Technical &Capability 1 Layer 1-20 layers 2 Material FR-4(High TG),Aluminum base,Polyimide,CEM-1,CEM-3, Rogers,FR4 halogen free,TEFLON etc 3 Board thickness 0.2mm-6mm 4 Max.finished board size 1200*600mm 5 Min.drilled ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

Circuit Board Comparison

	Mpu-2fk Main Board, Induction Furnace PCB Multilayer Circuit Board Contact Now	Quick View Industrial Main PCB Board for Printer/Scanner/Set Top Box Contact Now	Quick View Electronics PCB Manufacturer for Tablet PC/White Goods/LCD TV Contact Now	Quick View 4L PCB Min. Hole Wall Cu 30um with Lf-HASL for Industrial Frequency Converter Contact Now	Quick View 4layer PCB 1.0mm Enig, Min. Space 2.8mil, BGA to Line 2.5mil with Impedance Control Contact Now

Transaction Info
	Mpu-2fk Main Board, Induction Furnace PCB Multilayer Circuit Board Contact Now	Quick View Industrial Main PCB Board for Printer/Scanner/Set Top Box Contact Now	Quick View Electronics PCB Manufacturer for Tablet PC/White Goods/LCD TV Contact Now	Quick View 4L PCB Min. Hole Wall Cu 30um with Lf-HASL for Industrial Frequency Converter Contact Now	Quick View 4layer PCB 1.0mm Enig, Min. Space 2.8mil, BGA to Line 2.5mil with Impedance Control Contact Now
Price	US $ 0.01-0.20/ Piece	US $ 1.15-22.00/ Piece	US $ 2.13-21.00/ Piece	US $ 2.25-26.00/ Piece	US $ 0.23-28.00/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Test: Flying Probe and Fixture; Solder Mask: Green; Board Thickness: 0.8mm / 1.6mm Custom; Custom: OEM / ODM; Copper: 0.5oz / 18um, 2oz / 70um; Layers: 4 Layers, 6 Layers, 8 Layers, Custom; Legend: White;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi Material; Insulation Materials: Epoxy Resin; Layer Count: 4-24layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Standard: Ipc III; Certificates: RoHS CCC ISO;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi High Tg180; Insulation Materials: Epoxy Resin; Layer Count: 4-28layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Standard: Ipc II; Certificates: RoHS CCC ISO;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi High Tg170; Insulation Materials: Epoxy Resin; Layer Count: 4-32layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Standard: Ipc II; Certificates: RoHS CCC ISO;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4 Shengyi High Tg170; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 4-36layer Through Hole Board; Surface Finish: Immersion Gold; Hole Wall Cu: Min. 20um; Standard: Ipc II; Certificates: RoHS CCC ISO;
Supplier Name	Abis Circuits Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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