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Custom Big&Small PCB Board

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-80.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Kb
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification Custom
Trademark Abis Circuits
Origin Shenzhen, China
Certification UL,ISO9001&ISO14001,SGS,RoHS Report
Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
Board Thickness 0.2-6mm
Copper Thickness 0.5-8oz
Layers 1-20layers

Product Description

Custom Big&Small PCB Board ABIS CIRCUITS CO., LTD is a professional PCB company which is focus on double side, Multilayer and HDI pcb mass production. The company was established in 2006, We have two factories together (audited by UL,ISO9001/14001,SGS,RoHS report),And all products adhere to IPC ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

PCB Board Comparison

	Custom Big&Small PCB Board Contact Now	4 Layer PCB on 0.254mm RO4350b 18/18um + Fr4 0.36mm 35/35um with Immersion Gold Contact Now	5 Layer PCB Built on Mixed RO4350b and Fr-4 at 1.0mm Thick with Enig Contact Now	Hybrid PCB Built on 20mil RO4350b and Fr4 with Immersion Silver Contact Now	Hybrid PCB Built on 8 Mil RO4003c and Fr4 with Immersion Silver and Blue Color Contact Now

Transaction Info
	Custom Big&Small PCB Board Contact Now	4 Layer PCB on 0.254mm RO4350b 18/18um + Fr4 0.36mm 35/35um with Immersion Gold Contact Now	5 Layer PCB Built on Mixed RO4350b and Fr-4 at 1.0mm Thick with Enig Contact Now	Hybrid PCB Built on 20mil RO4350b and Fr4 with Immersion Silver Contact Now	Hybrid PCB Built on 8 Mil RO4003c and Fr4 with Immersion Silver and Blue Color Contact Now
Price	US $ 0.10-80.00/ Piece	US $ 0.35/ Piece	US $ 0.37/ Piece	US $ 0.42/ Piece	US $ 0.45/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	UL,ISO9001&ISO14001,SGS,RoHS Report	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million
Business Model	OEM	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)	OEM, Own Brand(Bicheng)
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20layers;	Type: Rigid Circuit Board; Dielectric: RO4350b and Fr-4; Material: Hydrocarbon/Woven Glass +Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Glass Reinforced Hydrocarbon+Epoxy Resin; Final Foil External: 1.0 Oz; Final Foil Internal: 1 Oz; Board Thickness: 1.3 mm ±10%; Surface Finish: Immersion Gold; Solder Mask Color: Green; Colour of Component Legend: White; Minimum Trace and Spac: 5.5 Mil / 7.5 Mil; Minimum / Maximum Holes: 0.4 mm / 5.7 mm; Via: Minimum Size 0.4mm.; Test: 100% Electrical Test Prior Shipment;	Type: Rigid Circuit Board; Dielectric: RO4350b and Fr-4; Material: Hydrocarbon/Woven Glass +Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Glass Reinforced Hydrocarbon+Epoxy Resin; Final Foil External: 1.0 Oz; Final Foil Internal: 1.0 Oz; Board Thickness: 1.0 mm ±0.1; Surface Finish: Immersion Gold; Solder Mask Color: Green; Colour of Component Legend: White; Minimum Trace and Spac: 5 Mil / 5 Mil; Minimum / Maximum Holes: 0.4 mm / 5.0 mm; Via: Minimum Size 0.4mm.; Test: 100% Electrical Test Prior Shipment;	Type: Rigid Circuit Board; Dielectric: RO4350b and Fr-4; Material: Hydrocarbon/Woven Glass +Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Glass Reinforced Hydrocarbon+Epoxy Resin; Final Foil External: 2 Oz; Final Foil Internal: 2 Oz; Board Thickness: 1.8mm ±0.18; Surface Finish: Immersion Silver; Solder Mask Color: Blue; Colour of Component Legend: No; Minimum Trace and Spac: 5 Mil / 6 Mil; Minimum / Maximum Holes: 0.4 /4.5 mm; Via: Blind Via L2-L4, L3-L4; Test: 100% Electrical Test Prior Shipment;	Type: Rigid Circuit Board; Dielectric: RO4003c and Fr-4; Material: Hydrocarbon/Woven Glass +Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Glass Reinforced Hydrocarbon+Epoxy Resin; Final Foil External: 1 Oz; Final Foil Internal: 1 Oz; Board Thickness: 1.1 mm ±0.11; Surface Finish: Immersion Silver; Solder Mask Color: Blue; Colour of Component Legend: No; Minimum Trace and Spac: 7.8 Mil / 4.4 Mil; Minimum / Maximum Holes: 0.3 mm / 2.5 mm; Via: Minimum Size 0.3mm; Test: 100% Electrical Test Prior Shipment;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd
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