Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Special Process: Stiffeners etc;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Enig Thickness: 1-3u'';
Copper Thickness: 0.5-8oz;
Hard Gold Thickness: 5-50u'';
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Not Specified;
Type: Flexible Printed Circuit Board;
Solder Mask Color: Green/Black/White/Blue/Yellow/Red;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
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Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Base Material: Copper;
Type: Flexible Printed Circuit Board;
Solder Mask Color: Green/Black/White/Blue/Yellow/Red;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Structure: 2-Layer Rigid-Flex PCB;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
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