Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, OSP;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Core Base Board: 0.3mm 0.5mm 0.6mm 0.8mm 1.0mm;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Core Base Board: 0.3mm 0.5mm 0.6mm 0.8mm 1.0mm;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Organic Resin;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Core Base Board: 0.3mm 0.5mm 0.6mm 0.8mm 1.0mm;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Fr-4;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Core Base Board: 0.3mm 0.5mm 0.6mm 0.8mm 1.0mm;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
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