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Custom Design PCB Board Fabricator

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-80.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric Fr4 +Pi
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid & Flex
Processing Technology Electrolytic Foil
Base Material Kb
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification Custom
Trademark Abis Circuits
Origin Shenzhen, China
Certification UL,ISO9001&ISO14001,SGS,RoHS Report
Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
Board Thickness 0.2-6mm
Copper Thickness 0.5-8oz
Layers 1-20layers

Product Description

Custom Design PCB Board Fabricator ABIS CIRCUITS CO., LTD is a professional PCB company which is focus on double side, Multilayer and HDI pcb mass production. The company was established in 2006, We have two factories together (audited by UL,ISO9001/14001,SGS,RoHS report),And all products adhere ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

PCB Fabricator Comparison

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Transaction Info
	Custom Design PCB Board Fabricator Contact Now	Quick View OEM PCB Design Multilayer HDI Printed Circuit Board Contact Now	Quick View Multi-Layer PCB Printed Circuit Board PCBA Assembly for Consumer Electronics Contact Now	Quick View Professional PCB Board Manufacturer SMT Processing PCB Assembly PCBA Board Contact Now	Quick View China Professional Mc PCB Ceramic Substrate PCB Manufacturer with Electronic Products Manufacturer Contact Now
Price	US $ 0.10-80.00/ Piece	US $ 0.76-5.00/ Piece	US $ 3.26-8.75/ Piece	US $ 0.87-5.00/ Piece	US $ 0.1/ PCS
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	1 PCS
Payment Terms	T/T, Western Union, Paypal	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	L/C, T/T, D/P, Paypal
Quality Control
Product Certification	UL,ISO9001&ISO14001,SGS,RoHS Report	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	Above US$100 Million
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: Fr4 +Pi; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid & Flex; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20layers;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: AIN; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Uc; Surface Finihsing: HASL-Lf; Board Layer: 2 Layers; Lead Time: 6 Working Days;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Ucreate PCB Co., Ltd.
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