Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Eng Thickness: 1-3u;
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 5-50u;
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Mode of Production: SMT;
Layers: 1-28 Layers;
Customized: Customized;
Condition: New;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Min. Chip Placement: 0201;
Item: Electronic PCB Board Assembly;
Other PCBA Service: Conformal Coating;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Turnkey Service: PCB, PCB Assembly, Box Build;
Applicaton: Industrial PCB PCBA;
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Mode of Production: SMT;
Layers: 1-28 Layers;
Customized: Customized;
Condition: New;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Min. Chip Placement: 0201;
Item: Electronic PCB Board Assembly;
Other PCBA Service: Conformal Coating;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Turnkey Service: PCB, PCB Assembly, Box Build;
Applicaton: Industrial PCB PCBA;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
|
Mode of Production: SMT;
Layers: 1-28 Layers;
Customized: Customized;
Condition: New;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Min. Chip Placement: 0201;
Item: Electronic PCB Board Assembly;
Other PCBA Service: Conformal Coating;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Turnkey Service: PCB, PCB Assembly, Box Build;
Applicaton: Industrial PCB PCBA;
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