HDI Digital PCB PCBA Board Aluminum PCB with SMT/DIP Assembly PCBA Supplier

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.001-20.00 / Piece

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 265*124 mm
  • Trademark Abis
  • Origin China
  • Solder Color Red, Green, Black, White, Blue, Other
  • Surface Finish HASL, Enig, OSP, Tin, Other
  • Thickness 0.8mm, 0.4mm, 1.6mm, Other
  • Layer Thickness 0.5oz, 1oz, 1.5oz, Max 6oz

Product Description

Product Description HDI PCB Boards Sucessful Cases Show -Definition HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than ...

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Transaction Info
Price US $ 0.001-20.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece
Min Order 1 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms L/C, T/T, Western Union, Paypal, 30 days net T/T, Paypal T/T, Paypal T/T, Paypal T/T, Paypal
Quality Control
Product Certification - IATF16949, UL, ISO IATF16949, UL, ISO IATF16949, UL, ISO IATF16949, UL, ISO
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, QC 080000 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, QC 080000 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, QC 080000 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, QC 080000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia, Mid East, Eastern Asia North America, South America, Southeast Asia, Mid East, Eastern Asia North America, South America, Southeast Asia, Mid East, Eastern Asia North America, South America, Southeast Asia, Mid East, Eastern Asia
Annual Export Revenue US$50 Million - US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Solder Color: Red, Green, Black, White, Blue, Other;
Surface Finish: HASL, Enig, OSP, Tin, Other;
Thickness: 0.8mm, 0.4mm, 1.6mm, Other;
Layer Thickness: 0.5oz, 1oz, 1.5oz, Max 6oz;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Haizhanni;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Layers: 1-24layers;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Haizhanni;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Layers: 1-24layers;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Haizhanni;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Layers: 1-24layers;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Haizhanni;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Layers: 1-24layers;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Haizhanni Electronic Circuit Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Haizhanni Electronic Circuit Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Haizhanni Electronic Circuit Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Haizhanni Electronic Circuit Co., Ltd.

Diamond Member Audited Supplier