PCB
US$0.10-80.00 / Piece
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What is HASL&Immersion Tin PCB Circuit Board Shenzhen Factory Price Multilayer Printed Circuit Board Blind and Buried Holes Immersion Gold, HDI PCB Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-80.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Kb
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification Custom
  • Trademark Abis Circuits
  • Origin Shenzhen, China
  • Certification UL,ISO9001&ISO14001,SGS,RoHS Report
  • Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
  • Board Thickness 0.2-6mm
  • Copper Thickness 0.5-8oz
  • Layers 1-20layers

Product Description

HASL&Immersion Tin PCB Circuit Board ABIS CIRCUITS CO., LTD is a professional PCB manufacturing which is focus on double side, Multilayer and HDI pcb mass production. The company was established on 2006, We have two factories together(audited by UL,ISO9001/14001,SGS,RoHS report) ,And all products ...

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PCB Comparison
Transaction Info
Price US $ 0.10-80.00/ Piece US $ 71/ Piece US $ 11.8/ Piece US $ 141/ Piece US $ 54/ Piece
Min Order 1 Pieces 500 Pieces 500 Pieces 500 Pieces 500 Pieces
Payment Terms T/T, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal
Quality Control
Product Certification UL,ISO9001&ISO14001,SGS,RoHS Report - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
Annual Export Revenue US$50 Million - US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Layers: 1-20layers;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 2.18;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 0.13;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 2.25;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 0.74;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier