| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 1 Oz/2oz;
Board Layer: 4 Layers;
Board Thickness: 1.6mm;
Surface Finish: Gold Plating, Enig;
Solder Mask: Green;
Legend: White;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate;
Application: Communication, Consumer Electronics;
Flame Retardant Properties: V1, V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Brand: Fastline;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1-50;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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Structure: Single-Sided FPC, Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyimide, Polyester Glass Fiber Mat Laminate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Board Material: Polyimide;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
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Structure: Double-Sided Rigid PCB, Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4 PCB, Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: Hb, V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Organic Resin;
Brand: FL;
Board Material: Fr-4 (Tg 135 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Blue;
Silk Screen: White;
Flying Probe Test: Yes;
Product Name: Low Cost Fr4 PCB Manufacturing with Enig Finishing;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate;
Application: Communication, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Board Material: Fr4, Rogers;
Board Layer: 1-26;
Board Thickness: 0.8mm-3.0mm;
Copper Thickness: 0.5 Oz-6 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.15mm;
Min Trace: 0.15mm;
Surface Finishing: Immersion Gold;
Solder Mask: Customized;
Lead Time: 4-5 Working Days;
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