Multilayer HDI PCB Board Sensor PCB Power Circuits Board with Blind and Buried Vias

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-5.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper ,PP
  • Insulation Materials Epoxy Resin
  • Brand Kb,Shenyi,Rogers,Iteq
  • Transport Package Vacuum Packing
  • Specification 150*120
  • Trademark Abis
  • Origin Shenzhen, China
  • Layer 1-20 Layers
  • Raw Material Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.
  • Board Outline Tolerance +0.10mm
  • Minimum Line/ Space 0.075mm
  • Impedance Control Tolerance +/-10%

Product Description

Multilayer HDI PCB Board Sensor PCB Power Circuits Board with Blind and Buried Vias Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline ...

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Multilayer PCB Comparison
Transaction Info
Price US $ 0.01-5.00/ Piece US $ 0.10-10.00/ Piece US $ 1/ Piece US $ 1/ Piece US $ 1/ Piece
Min Order 1 Pieces 1 Pieces 1000 Pieces 1000 Pieces 1000 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Product Certification - - RoHS RoHS RoHS
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, ISO 20000 ISO 9001, ISO 14001, ISO 20000 ISO 9001, ISO 14001, ISO 20000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$10 Million - US$50 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million
Business Model OEM OEM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: 6-12 months
Peak Season Lead Time: 6-12 months
Off Season Lead Time: 6-12 months
Peak Season Lead Time: 6-12 months
Off Season Lead Time: 6-12 months
Peak Season Lead Time: 6-12 months
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper ,PP;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Outline Tolerance: +0.10mm;
Minimum Line/ Space: 0.075mm;
Impedance Control Tolerance: +/-10%;
Type: Rigid Circuit Board;
Dielectric: Rogers 4534;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Rogers 4534;
Insulation Materials: Epoxy Resin;
Brand: EEG;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: 2-4 Layers;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier