Qualified GSM Sdma GPS Fr4 PCB Borad Printed Circuit Board Video

Name: Qualified GSM Sdma GPS Fr4 PCB Borad Printed Circuit Board
Uploaded: 2023-07-18T11:40:44+08:00
Description: Qualified GSM Sdma GPS FR4 PCB Borad Printed Circuit Board 1. Single, Double side & Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole.

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.01-150.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Base Material Kingboard
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packaging
Specification ISO9001& ISO14001& SGS& UL
Trademark ABIS CIRCUITS CO., LTD
Origin Made in China
Copper 105um
PCB Material Fr4 Tg170
Surface Finish Hal
Thickness 2.0

Product Description

Qualified GSM Sdma GPS FR4 PCB Borad Printed Circuit Board 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable mask, 4. ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

PCB Comparison

	Qualified GSM Sdma GPS Fr4 PCB Borad Printed Circuit Board Contact Now	Quick View Circular High-Conductivity Aluminum PCB for Indoor Lighting Contact Now	Quick View Finish Enig+Gold Fingers 30u Impedance Control 100ohm 8layer PCB Contact Now	Quick View 8layer 1.0mm Enig with BGA to Line 3mil Inner Core Material 0.1mm Motherboard PCB Contact Now	Quick View 8layer 1.0mm OSP Pad in Via 0.2mm, Impedance Control Min. Space 4mil Circuit Board PCB Contact Now

Transaction Info
	Qualified GSM Sdma GPS Fr4 PCB Borad Printed Circuit Board Contact Now	Quick View Circular High-Conductivity Aluminum PCB for Indoor Lighting Contact Now	Quick View Finish Enig+Gold Fingers 30u Impedance Control 100ohm 8layer PCB Contact Now	Quick View 8layer 1.0mm Enig with BGA to Line 3mil Inner Core Material 0.1mm Motherboard PCB Contact Now	Quick View 8layer 1.0mm OSP Pad in Via 0.2mm, Impedance Control Min. Space 4mil Circuit Board PCB Contact Now
Price	US $ 0.01-150.00/ Piece	US $ 0.68-2.30/ Piece	US $ 0.48-5.90/ Piece	US $ 0.24-3.20/ Piece	US $ 0.26-3.40/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Kingboard; Insulation Materials: Epoxy Resin; Brand: Abis; Copper: 105um; PCB Material: Fr4 Tg170; Surface Finish: Hal; Thickness: 2.0;	Structure: Metal Base Rigid PCB; Dielectric: Al; Material: Metal Material; Application: LED Light; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Aluminum; Insulation Materials: Metal Composite Materials;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Immersion Gold+Gold Fingers; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; BGA Gap: 3mil; Other: Impedance Control;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; BGA Gap: 3mil; Inner Core Material: 0.1mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: OSP; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Pad in Via: 0.2mm; Other: Impedance Control;
Supplier Name	Abis Circuits Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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