Integrated Circuit
US$0.0001-29.90 / Piece
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What is Shenzhen Abis Industrial Machine Control Printed Circuit Board Assembly PCB PCBA

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.0001-29.90 / Piece

Sepcifications

  • Insulation Materials Epoxy Resin
  • Flame Retardant Properties V0
  • Application Vehicles
  • Transport Package Vacuum Packing
  • Specification 50mm*120mm
  • Trademark Abis
  • Origin Shenzhen, China
  • Solder Mask Green
  • Surface Finish Enig (2u′′)
  • Base Material Fr4
  • Layers 8 Layers
  • OEM Accept Custom
  • Character Bendable

Product Description

Shenzhen ABIS Industrial Machine Control Printed Circuit Board Assembly PCB PCBA Company Brief Introduction Abis Circuits Co. Ltd, established in 2006, is Located in Shenzhen, company has about 1100 workers and two PCB workshops with about 50000 square meters. Our products are ...

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Integrated Circuit Comparison
Transaction Info
Price US $ 0.0001-29.90/ Piece US $ 2.25-9.60/ Piece US $ 2.25-9.60/ Piece US $ 2.86-8.70/ Piece US $ 0.98-2.39/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Payment Terms T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Vehicles;
Solder Mask: Green;
Surface Finish: Enig (2u'');
Base Material: Fr4;
Layers: 8 Layers;
OEM: Accept Custom;
Character: Bendable;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace, Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Blind Vias: 0.1mm;
Buried Vias: 0.1mm;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Blind Vias: 0.1mm;
Buried Vias: 0.1mm;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Medical Device;
Blind Vias: 0.1mm;
Buried Vias: 0.1mm;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier