Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Eng Thickness: 1-3u;
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 5-50u;
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Metal Coating: Silver;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Application Field: LED, Medical, Industrial, Control Board;
Assembly Modes: SMT, DIP, Through Hole;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Needed: Gerber File, Bom List, Sample If Better;
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Metal Coating: Silver;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Application Field: LED, Medical, Industrial, Control Board;
Assembly Modes: SMT, DIP, Through Hole;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Needed: Gerber File, Bom List, Sample If Better;
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Metal Coating: Silver;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Application Field: LED, Medical, Industrial, Control Board;
Assembly Modes: SMT, DIP, Through Hole;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Needed: Gerber File, Bom List, Sample If Better;
|
Metal Coating: Silver;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Application Field: LED, Medical, Industrial, Control Board;
Assembly Modes: SMT, DIP, Through Hole;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Needed: Gerber File, Bom List, Sample If Better;
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