Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: No;
PCB Material: Fr4;
PCB Layer: 2;
PCB Impedance Control: No;
PCB Buried& Blind Vias: No;
PCB Copper Thickness: 35um;
Hard Gold: N/a;
Min Line/Width: 6mil;
Min Drill: 0.15mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: FR-4;
Copper Thickness: 3oz;
Surface Finishing: HASL;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Line Spacing: 0.1mm;
Min. Line Width: 0.1mm;
Layer: 2 Layer;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Silkscreen: White, Black, Red;
Solder Mask: Green, Yellow, Red, White, Black, Blue;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Min Line Spacing: 0.2mm;
Min Line Width: 0.2mm;
Min Hole Size: 0.25mm;
Package: Vacuum;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Solder Mask: Green,White, Black, Red;
Silkscreen: Green,White, Black, Red;
PCB Material Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 3.2mm;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Certificates: UL, RoHS, SGS, ISO9001;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Board Thickness: 1.6mm;
Layer: 1 to 28 Layers;
Meterial Type: Fr-4,Cem-1,High Tg,Fr4 Halogen Free,Rogers;
Copper Thickness: 1.0oz;
Min Line Width: 0.075mm;
Min Line Spacing: 0.075mm;
Min Hole Size: 0.075;
Surface Finishing: Immersion Gold;
Package: Vacuum;
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