Customized High Density HDI Multilayer Rigid PCB Fr4 Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-4
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 120*100mm
  • Trademark ABIS CIRCUITS
  • Origin Shenzhen, China
  • Copper Thickness 1 Oz/2oz
  • Board Layer 2 Layers
  • Board Thickness 1.6mm
  • Surface Finish Gold Plating, Enig
  • Solder Mask Green
  • Legend White

Product Description

Customized High Density HDI Multilayer Rigid PCB Fr4 Board Company Brief Introduction Abis Circuits Co. Ltd, established in 2006, Located in Shenzhen, our company has about 1100 workers and two PCB workshops with about 50000 square meters. Our products are mostly used in the field of ...

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PCB Comparison
Transaction Info
Price US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece
Min Order 1 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms T/T, Western Union, Paypal T/T, Paypal T/T, Paypal T/T, Paypal T/T, Paypal
Quality Control
Product Certification - IATF16949, UL, ISO IATF16949, UL, ISO IATF16949, UL, ISO IATF16949, UL, ISO
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, QC 080000 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, QC 080000 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, QC 080000 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, QC 080000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia, Mid East, Eastern Asia North America, South America, Southeast Asia, Mid East, Eastern Asia North America, South America, Southeast Asia, Mid East, Eastern Asia North America, South America, Southeast Asia, Mid East, Eastern Asia
Annual Export Revenue US$50 Million - US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 1 Oz/2oz;
Board Layer: 2 Layers;
Board Thickness: 1.6mm;
Surface Finish: Gold Plating, Enig;
Solder Mask: Green;
Legend: White;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Haizhanni;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Layers: 1-24layers;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Haizhanni;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Layers: 1-24layers;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Haizhanni;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Layers: 1-24layers;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Haizhanni;
MOQ: 0;
Test: 100% E-Test;
Copper Thickness: 0.5-120z(18-420um);
Board Thickness: 1.0-2.0mm;
HS: 8534009;
Annual Production Capacity: 500000PCS/Year;
Solder Mask Color: Green/Black/White/Red/Blue/Y Ellow;
Layers: 1-24layers;
Surface Treatment: Gold Finger/Hard Gold/HASL/Haslfree;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Haizhanni Electronic Circuit Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Haizhanni Electronic Circuit Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Haizhanni Electronic Circuit Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Haizhanni Electronic Circuit Co., Ltd.

Diamond Member Audited Supplier