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US$0.01-100.00 / Piece

PCB Customized Service 1-40 Layers Circuits Board Fr4 High Tg Fr4 PCB pictures & photos

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What is PCB Customized Service 1-40 Layers Circuits Board Fr4 High Tg Fr4 PCB

Name: PCB Customized Service 1-40 Layers Circuits Board Fr4 High Tg Fr4 PCB
Uploaded: 2023-11-14T14:03:03+08:00
Description: PCB Customized Service 1-40 Layers Circuits Board FR4 High Tg FR4 PCB Technical & Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON et

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.01-100.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric CEM-1
Material Fiberglass Epoxy
Application Computer
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Abis
Transport Package Vacuum Packing
Specification 100*100mm
Trademark ABIS
Origin China
Board Thickness 0.20mm-8.00mm
Board Outline Tolerance +0.10mm
out Layer Copper Thickness 18um--350um
Inner Layer Copper Thickness 17um--175um
Minimum Line 0.075mm
Minimum Space 0.075mm

Product Description

PCB Customized Service 1-40 Layers Circuits Board FR4 High Tg FR4 PCB Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

PCB Comparison

	PCB Customized Service 1-40 Layers Circuits Board Fr4 High Tg Fr4 PCB Contact Now	Quick View Fr4 Multilayer PCB, BGA, High Tg, Blind Hole Contact Now	High Tg HDI Blind Buried BGA Control Impedance PCB Contact Now	Multi-Layer PCB with Lead-Free HASL and High Tg Laminate Contact Now	Quick View 2018 Latest Lead Free HASL PCB for Consumer Electronics Contact Now

Transaction Info
	PCB Customized Service 1-40 Layers Circuits Board Fr4 High Tg Fr4 PCB Contact Now	Quick View Fr4 Multilayer PCB, BGA, High Tg, Blind Hole Contact Now	High Tg HDI Blind Buried BGA Control Impedance PCB Contact Now	Multi-Layer PCB with Lead-Free HASL and High Tg Laminate Contact Now	Quick View 2018 Latest Lead Free HASL PCB for Consumer Electronics Contact Now
Price	US $ 0.01-100.00/ Piece	US $ 8.50-10.50/ Piece	US $ 10.5/ Piece	US $ 5.5/ Piece	US $ 1.50-4.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million
Business Model	OEM	OEM, ODM, Own Brand(KMC)	OEM, ODM, Own Brand(KMC)	OEM, ODM, Own Brand(KMC)	OEM, ODM, Own Brand(KMC)
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: CEM-1; Material: Fiberglass Epoxy; Application: Computer; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Board Thickness: 0.20mm-8.00mm; Board Outline Tolerance: +0.10mm; out Layer Copper Thickness: 18um--350um; Inner Layer Copper Thickness: 17um--175um; Minimum Line: 0.075mm; Minimum Space: 0.075mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lead-Free; Base Material: Copper; Insulation Materials: Epoxy Resin; Material Type: Fr4,High Tg,Cem1,Cem3,Aluminiaum Base,Arlon,Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 0.003''; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lead-Free; Base Material: Copper; Insulation Materials: Epoxy Resin; Material Type: Fr4,High Tg,Cem1,Cem3,Aluminiaum Base,Arlon,Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 0.003''; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion. Gold; Base Material: Copper; Insulation Materials: Epoxy Resin; Material Type: Fr4,High Tg,Cem1,Cem3,Aluminiaum Base,Arlon,Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 0.003''; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion. Gold; Base Material: Copper; Insulation Materials: Epoxy Resin; Material Type: Fr4,High Tg,Cem1,Cem3,Aluminiaum Base,Arlon,Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 0.003''; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Supplier Name	Abis Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.
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