FPC/Rigid-Flex PCB/ Flex PCB Used in Display Screen, Cellphone PCB Motherboard FPC Customization

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-10.00 / Piece

Sepcifications

  • Insulation Materials Epoxy Resin
  • Flame Retardant Properties V0
  • Application Consumer Electronics
  • Transport Package Vacuum Packing
  • Specification 560*12 mm
  • Trademark Abis
  • Origin Shenzhen, China
  • Layer 1-2 Layers
  • Common Finish Board Thickness 0.3-5mm
  • Raw Material Aluminum Base, Copper Base
  • Min Line Width/Space 3mil(0.075mm)
  • Impedance Control Tolerance +/-10%
  • Solder Mask/Silkscreen Custom

Product Description

FPC/Rigid-Flex PCB/ Flex PCB Used in Display Screen, Cellphone PCB Motherboard FPC Customization Technical &Capability Item Speci. Layers 1~8 Board Thickness 0.1mm-0.2mm Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz) ...

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Flex-Rigid PCB Comparison
Transaction Info
Price US $ 0.01-10.00/ Piece US $ 1.58-6.90/ Piece US $ 1.98-7.30/ Piece US $ 0.50-1.00/ Piece US $ 1.00-20.00/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, D/P, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification - - - - RoHS, UL CE, GS, ISO
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million Above US$100 Million US$10 Million - US$50 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM, Own Brand() OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layer: 1-2 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Solder Mask/Silkscreen: Custom;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Insulation Materials: Metal Composite Materials;
Flame Retardant Properties: V0;
Thick Copper: Thick Copper Board;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Fr4 +Polyimide;
Brand: Exceeding;
Delivery: 24hours--5days;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
One-Stop Service: PCB Assembly, Component Supply;
Service: Factory Price;
MOQ: 1 PCS;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free;
Testing Service: 100% E-Testing;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

China Dragon Electronic Industrial Co., Limited

Diamond Member

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier