| Specification |
Task: Adjust;
Structure: Combination;
Mathematical Model: Linear;
Signal: Continuous;
Function: Automatic Control, Monitoring;
Condition: New;
Customized: Customized;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Type: Combining Rigid Circuit Board;
Dielectric: Fr-4;
Application: Aerospace;
Flame Retardant Properties: Hb;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Product Name: Circuit Board;
Min. Hole Size: 0.1mm;
Min. Line Spacing: 0.1mm;
Keywords: PCB Board;
Board Thickness: 1.6mm;
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Task: Following;
Structure: Open-Loop;
Mathematical Model: Linear;
Signal: Continuous;
Function: Automatic Control, Protection, Monitoring, Measurement;
Condition: Used;
Customized: Customized;
Material: Stainless Steel;
Product Name: Copper Bonded Steel Ground Rod;
Ground Rod Material: Copper Bonded Steel;
Standard: UL 467;
Copper Layer Thickness: >=0.254mm;
Tensile Strength: >=580nm/mm;
Length: 1.2m~3.0m(4FT~10FT);
Copper Grade: 99.9%;
Normal Diameter: 3/8".1/2". 5/8". 3/4". 1";
Process: Electroplating;
Application: Grounding System;
Copper Thickness: 50micro to 254micron;
Custom Length: 1200mm,1500mm,1800mm,2100mm,2400mm,3000mm;
Other Standard: BS En 50164-2,BS 7430;
Purity: 99.9% Electronic Copper and Low Carbon Steel;
Surface Treatment: Hot DIP Galvanized;
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Task: Adjust;
Structure: Combination;
Mathematical Model: Linear;
Signal: Continuous;
Function: Automatic Control, Protection, Monitoring, Measurement;
Condition: Used;
Customized: Customized;
Material: Stainless Steel;
Product Name: Copper Bonded Steel Ground Rod;
Ground Rod Material: Copper Bonded Steel;
Standard: UL 467;
Copper Layer Thickness: >=0.254mm;
Tensile Strength: >=580nm/mm;
Length: 1.2m~3.0m(4FT~10FT);
Copper Grade: 99.9%;
Normal Diameter: 3/8".1/2". 5/8". 3/4". 1";
Process: Electroplating;
Application: Grounding System;
Copper Thickness: 50micro to 254micron;
Custom Length: 1200mm,1500mm,1800mm,2100mm,2400mm,3000mm;
Other Standard: BS En 50164-2,BS 7430;
Purity: 99.9% Electronic Copper and Low Carbon Steel;
Surface Treatment: Hot DIP Galvanized;
|
Task: Adjust;
Structure: Combination;
Mathematical Model: Linear;
Signal: Continuous;
Function: Automatic Control, Protection, Monitoring, Measurement;
Condition: Used;
Customized: Customized;
Material: Stainless Steel;
Product Name: Copper Bonded Steel Ground Rod;
Ground Rod Material: Copper Bonded Steel;
Standard: UL 467;
Copper Layer Thickness: >=0.254mm;
Tensile Strength: >=580nm/mm;
Length: 1.2m~3.0m(4FT~10FT);
Copper Grade: 99.9%;
Normal Diameter: 3/8".1/2". 5/8". 3/4". 1";
Process: Electroplating;
Application: Grounding System;
Copper Thickness: 50micro to 254micron;
Custom Length: 1200mm,1500mm,1800mm,2100mm,2400mm,3000mm;
Other Standard: BS En 50164-2,BS 7430;
Purity: 99.9% Electronic Copper and Low Carbon Steel;
Surface Treatment: Hot DIP Galvanized;
|
Task: Adjust;
Structure: Combination;
Mathematical Model: Linear;
Signal: Continuous;
Function: Automatic Control, Protection, Monitoring, Measurement;
Condition: Used;
Customized: Customized;
Material: Stainless Steel;
Product Name: Copper Bonded Steel Ground Rod;
Ground Rod Material: Copper Bonded Steel;
Standard: UL 467;
Copper Layer Thickness: >=0.254mm;
Tensile Strength: >=580nm/mm;
Length: 1.2m~3.0m(4FT~10FT);
Copper Grade: 99.9%;
Normal Diameter: 3/8".1/2". 5/8". 3/4". 1";
Process: Electroplating;
Application: Grounding System;
Copper Thickness: 50micro to 254micron;
Custom Length: 1200mm,1500mm,1800mm,2100mm,2400mm,3000mm;
Other Standard: BS En 50164-2,BS 7430;
Purity: 99.9% Electronic Copper and Low Carbon Steel;
Surface Treatment: Hot DIP Galvanized;
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