CNC Cylindrical Grinder (MKE1320/H)

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About this Item

Price

Min. Order Reference FOB Price

1 Piece Negotiable

Sepcifications

Type External Grinding Machine
Processing Object Curve
Controlling Mode Artificial
Automatic Grade Automatic
Cylindrical Grinder Type Universal Cylindrical Grinder
Precision High Precision
Certification CE, ISO 9001
Transport Package Sea Worthy Packing
Specification CE
Trademark Acemachinetools
Origin China
Max. Grinding Diameter 200 Mm
Min. Grinding Diameter 8 Mm
Max. Workpiece Length 500 Mm

Product Description

Main application and feature: The CNC cylindrical grinder is suitable for batch production of cylindrical or multi-journals cylindrical parts grinding. The electrical system is controlled by PLC programmable controller, and the executive system is driven by the CNC servo driver and servo motor. ...

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ACE Machine Tools Co., Ltd.

Gold Member Since 2014

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products CNC Machine Tools, Lathe Machine, Press Brake Machine, CNC Milling Machine, Grinder Machine, Cutting Machine, Plate Bending Machine, Shearing Machine, CNC Lathe Machine
Registered Capital 2000000 USD
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 20000
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

Cylindrical Grinding Machine Comparison

	CNC Cylindrical Grinder (MKE1320/H) Contact Now	300mm Size Wafer Surface Ultra-Precision Processing Substrates Grinding Machine for Semiconductor Application Contact Now	200mm Optical Glass Precision Surface Polishing Finishing Machine for Sensor or Substrates Contact Now	300mm Substrate Single Side Precision Lapper Polisher for Wafer Manufacturer Supplier Contact Now	Metal and Non-Metal Mechanical Seals High Precision Lapping Polishing Machine Contact Now

Transaction Info
	CNC Cylindrical Grinder (MKE1320/H) Contact Now	300mm Size Wafer Surface Ultra-Precision Processing Substrates Grinding Machine for Semiconductor Application Contact Now	200mm Optical Glass Precision Surface Polishing Finishing Machine for Sensor or Substrates Contact Now	300mm Substrate Single Side Precision Lapper Polisher for Wafer Manufacturer Supplier Contact Now	Metal and Non-Metal Mechanical Seals High Precision Lapping Polishing Machine Contact Now
Price	Negotiable	US $ 80,000.00-100,000.00/ Piece	US $ 80,000.00-100,000.00/ Piece	US $ 28,200.00-28,500.00/ Piece	US $ 28,200.00-28,500.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	FOB, CFR, CIF	-	-	-	-
Payment Terms	L/C, T/T, D/P	L/C, T/T	L/C, T/T	L/C, T/T	L/C, T/T
Quality Control
Product Certification	null, CE, ISO 9001	ISO 9001, SGS	ISO 9001, SGS	ISO 9001	ISO 9001
Management System Certification	ISO 9001, ISO 20000	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Domestic	Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Domestic	Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Domestic	Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)
Product Attributes
Specification	Type: External Grinding Machine; Processing Object: Curve; Controlling Mode: Artificial; Automatic Grade: Automatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: High Precision; Max. Grinding Diameter: 200 Mm; Min. Grinding Diameter: 8 Mm; Max. Workpiece Length: 500 Mm;	Warranty: 1 Year; Type: Surface Grinding Machine; Processing Object: Metal&Nonmetal; Abrasives: Grinding Disc; Controlling Mode: Normal; Automatic Grade: Semiautomatic; Precision: High Precision; Condition: New; Max. Grinding Diameter: 252mm; Model Number: Ks1000y; Voltage: 380V; Power: 36kw; Weight: 6500kg; After-Sales Service Provided: Engineers Available to Service Machinery Overseas;	Warranty: 1 Year; Type: Surface Grinding Machine; Processing Object: Metal&Nonmetal; Abrasives: Grinding Disc; Controlling Mode: Normal; Automatic Grade: Semiautomatic; Precision: High Precision; Condition: New; Max. Grinding Diameter: 252mm; Model Number: Ks1000y; Voltage: 380V; Power: 36kw; Weight: 6500kg; After-Sales Service Provided: Engineers Available to Service Machinery Overseas;	Warranty: 1 Year; Type: Surface Grinding Machine; Processing Object: Metal&Nonmetal; Abrasives: Grinding Disc; Controlling Mode: Normal; Automatic Grade: Semiautomatic; Precision: High Precision; Condition: New; Max. Grinding Diameter: 202mm; Model Number: Ks25b; Voltage: 380V; Power: 6.5kw; Weight: 1750kg; After-Sales Service Provided: Engineers Available to Service Machinery Overseas;	Warranty: 1 Year; Type: Surface Grinding Machine; Processing Object: Metal&Nonmetal; Abrasives: Grinding Disc; Controlling Mode: Normal; Automatic Grade: Semiautomatic; Precision: High Precision; Condition: New; Max. Grinding Diameter: 202mm; Model Number: Ks25b; Voltage: 380V; Power: 6.5kw; Weight: 1750kg; After-Sales Service Provided: Engineers Available to Service Machinery Overseas;
Supplier Name	ACE Machine Tools Co., Ltd.	Dongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd.	Dongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd.	Dongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd.	Dongguan KIZI Precision Lapping Mechanical Manufacture Co., Ltd.
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