Specification |
Application: Industrial Ceramics;
Thickness: 0.2-2mm;
Delivery: 30 Days;
Thermal Conductivity: Min 24 W/Mk;
Young's Modulus: 340 Gpa;
Forming Method: Tape Casting;
Grain Size: 1-10um;
Purity: 95%;
Type: Ceramic Plate;
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Application: Aerospace, Electronics, Medical, Refractory, Semiconductor, Industrial;
Material: AlN;
Density: 3.28-3.30 g/cm3;
Color: Grey, Black;
Thermal Conductivity: 160-230 W/M.K;
Max Working Temperature (in Air): 800 C;
Max Working Temperature (in Vacuum): 1200 C;
Max Working Temperature (in Inert Gas): 1500 C;
Dielectric Strength: 15 Kv/mm;
Type: Ceramic Plate;
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Application: Aerospace, Electronics, Medical, Refractory, Semiconductor, Industrial;
Material: AlN;
Density: 3.28-3.30 g/cm3;
Color: Grey, Black;
Thermal Conductivity: 160-230 W/M.K;
Max Working Temperature (in Air): 800 C;
Max Working Temperature (in Vacuum): 1200 C;
Max Working Temperature (in Inert Gas): 1500 C;
Dielectric Strength: 15 Kv/mm;
Type: Ceramic Plate;
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Application: Aerospace, Electronics, Medical, Refractory, Semiconductor, Industrial;
Material: AlN;
Density: 3.28-3.30 g/cm3;
Color: Grey, Black;
Thermal Conductivity: 160-230 W/M.K;
Max Working Temperature (in Air): 800 C;
Max Working Temperature (in Vacuum): 1200 C;
Max Working Temperature (in Inert Gas): 1500 C;
Dielectric Strength: 15 Kv/mm;
Type: Ceramic Plate;
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Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Conductive Layer: Thick Copper Layer;
Material: Al2O3;
Process: Direct Bonded Copper;
Thickness: 0.25, 0.32, 0.38, 0.5, 0.635, 0.76, 1, 2mm;
Density: 3.88g/cm3;
Color: White;
Flexural Strength: 450 MPa;
Thermal Conductivity: 30 W/M.K;
Dielectric Strength: >15 Kv/mm;
Grain Size: 1-10um;
Type: Ceramic Plate;
Purity: 99.6%;
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