Specification |
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Antenk;
Number of Contacts: 3 to 60pins;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Aviation and Aerospace,Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Brand: Finestpcb;
TPE: FPC, FPCB, Flexible PCB;
Copper Thickness: 1oz / 1/2 O Z/ 1/3 Oz, 1oz;
Min. Line Width: 0.04mm;
Min. Hole Size: 0.1mm;
Min. Line Spacing: 0.04mm;
Board Size: Ustom;
Product Name: Flexible Printed Circuit Board;
Service: OEM Flex PCB Boards Services;
Solder Mask: Green. Red. Blue. White. Black;
Keyword: 1-4 Layer Flexible Circuit PCB;
Surface Treatment: Immersion Gold/OSP/Immersion Silver/Immersion Tin;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Aviation and Aerospace,Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Brand: Finestpcb;
TPE: FPC, FPCB, Flexible PCB;
Copper Thickness: 1oz / 1/2 O Z/ 1/3 Oz, 1oz;
Min. Line Width: 0.04mm;
Min. Hole Size: 0.1mm;
Min. Line Spacing: 0.04mm;
Board Size: Ustom;
Product Name: Flexible Printed Circuit Board;
Service: OEM Flex PCB Boards Services;
Solder Mask: Green. Red. Blue. White. Black;
Keyword: 1-4 Layer Flexible Circuit PCB;
Surface Treatment: Immersion Gold/OSP/Immersion Silver/Immersion Tin;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Not Specified;
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Structure: FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Unspecified;
Type: Flexible Printed Circuit Board;
Solder Mask Color: Green/Black/White/Blue/Yellow/Red;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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