FPC
US$0.15 / Piece
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What is 5.08mm Pitch Wire to Board Connector Series 5081-01

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1000 Pieces US$0.15 / Piece

Sepcifications

  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Transport Package Tube / Reel Packing
  • Specification RoHS compliance
  • Trademark Antenk
  • Origin China
  • Number of Contacts 3 to 60pins

Product Description

5.08mm Pitch Wire to Board Connector Series Specification Electric Rated Voltage:600v AC, DC Rated Current:single pole≤16A Contact Resistance: ≤10mQ Proof Voltage:2200V AC(1 min) operat ing Temperature:-55C + 105C Materials Termi nal :brass Surface Treatment:Nickel plating ...

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FPC Comparison
Transaction Info
Price US $ 0.15/ Piece US $ 0.01-10.00/ Piece US $ 0.01-10.00/ Piece US $ 0.01-10.00/ Piece US $ 0.01-100.00/ Piece
Min Order 1000 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Paypal T/T, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Number of Contacts: 3 to 60pins;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer: 2layer;
Board Thickness: 0.2;
Surface Finish: Enig;
Copper Thickness: 35um;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Board Thickness: 0.1mm;
Layers: 2;
Surface Finish: Enig;
Copper Thickness: 35um;
Raw Material: Pi;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Board Thickness: 0.2mm;
Copper Thickness: 35um;
Raw Material: Pi;
Surface Finish: Enig;
Solder Mask: Coverlay;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Experience: More Than 10 Years;
Type: Factory;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Supplier Name

Antenk Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier