Specification |
Metal Coating: Copper;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Rated Power Input: 3kw/4kw/5kw/6kw/7kw/8kw/10kw/12kw/15kw/18kw/25kw;
Power Type: AC/DC Hybrid;
Rated Voltage: Three Phase AC380V, Single Phase AC220V;
Heat-Dissipating Method: Air Cooling, Liquid Cooling;
Operating Power Frequency: 50/60 Hz;
Type of Compressor: BLDC/Pmsm;
Communicated Method: RS485;
Refrigerant: R410;R32;R290;
Function: Cooling, Heating, Hot Water, Solar Power;
Remote Control: WiFi, APP;
Interaction: Touch Screen, Touch Button;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized PCB Board;
Condition: New;
Product Name: Customized PCB Board;
Keywords: Electronic Circuit Board;
PCB Portfolio: 1-20 Layers, Standard, HDI, High-Tg, RF Pcbs;
Copper Thickness: 0.5 Oz, 1 Oz, 1.5 Oz, 2 Oz, 3 Oz;
Basic Material: Fr4, Modified Epoxy, Polyimide, PTFE, Glass, Al;
Board Thickness: 0.2-5.0 mm or Customized;
Min. Width/Space: 0.075 mm or Customized;
Min. Sm Bridge: 0.1 mm or Customized;
Min. Hole Dia: 0.1 mm or Customized;
Thickness Tolerance: 8%;
Board Outline Tolerance: 0.15mm;
SMD Pitch: 0.3mm;
Service: One-Stop OEM Service;
Max. Stencial Size: Customized;
Surface Treatment: HASL/OSP/AG/Enig/Enepig/Immersion Silver/Tin;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized PCB Board;
Condition: New;
Product Name: Customized PCB Board;
Keywords: Electronic Circuit Board;
PCB Portfolio: 1-20 Layers, Standard, HDI, High-Tg, RF Pcbs;
Copper Thickness: 0.5 Oz, 1 Oz, 1.5 Oz, 2 Oz, 3 Oz;
Basic Material: Fr4, Modified Epoxy, Polyimide, PTFE, Glass, Al;
Board Thickness: 0.2-5.0 mm or Customized;
Min. Width/Space: 0.075 mm or Customized;
Min. Sm Bridge: 0.1 mm or Customized;
Min. Hole Dia: 0.1 mm or Customized;
Thickness Tolerance: 8%;
Board Outline Tolerance: 0.15mm;
SMD Pitch: 0.3mm;
Service: One-Stop OEM Service;
Max. Stencial Size: Customized;
Surface Treatment: HASL/OSP/AG/Enig/Enepig/Immersion Silver/Tin;
|
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized PCB Board;
Condition: New;
Product Name: Customized PCB Board;
Keywords: Electronic Circuit Board;
PCB Portfolio: 1-20 Layers, Standard, HDI, High-Tg, RF Pcbs;
Copper Thickness: 0.5 Oz, 1 Oz, 1.5 Oz, 2 Oz, 3 Oz;
Basic Material: Fr4, Modified Epoxy, Polyimide, PTFE, Glass, Al;
Board Thickness: 0.2-5.0 mm or Customized;
Min. Width/Space: 0.075 mm or Customized;
Min. Sm Bridge: 0.1 mm or Customized;
Min. Hole Dia: 0.1 mm or Customized;
Thickness Tolerance: 8%;
Board Outline Tolerance: 0.15mm;
SMD Pitch: 0.3mm;
Service: One-Stop OEM Service;
Max. Stencial Size: Customized;
Surface Treatment: HASL/OSP/AG/Enig/Enepig/Immersion Silver/Tin;
|
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized PCB Board;
Condition: New;
Product Name: Customized PCB Board;
Keywords: Electronic Circuit Board;
PCB Portfolio: 1-20 Layers, Standard, HDI, High-Tg, RF Pcbs;
Copper Thickness: 0.5 Oz, 1 Oz, 1.5 Oz, 2 Oz, 3 Oz;
Basic Material: Fr4, Modified Epoxy, Polyimide, PTFE, Glass, Al;
Board Thickness: 0.2-5.0 mm or Customized;
Min. Width/Space: 0.075 mm or Customized;
Min. Sm Bridge: 0.1 mm or Customized;
Min. Hole Dia: 0.1 mm or Customized;
Thickness Tolerance: 8%;
Board Outline Tolerance: 0.15mm;
SMD Pitch: 0.3mm;
Service: One-Stop OEM Service;
Max. Stencial Size: Customized;
Surface Treatment: HASL/OSP/AG/Enig/Enepig/Immersion Silver/Tin;
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