Manufacturer Fr4 Material Rogers FPC Prototype PCB RO4350b RO4003c Soldering Protoboard Printed Double Sided PCB Circuit Board

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-99 Pieces US$0.30

100-499 Pieces US$0.45

500-999 Pieces US$0.58

1,000+ Pieces US$0.68

Sepcifications

  • Dielectric FR-4
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Transport Package Anti-Static Bags/Customized Packaging
  • Specification 500mm X 400mm
  • Trademark OEM
  • Origin Shenzhen
  • Turnkey Service PCB Manufacturing +Purchase Components+Assembly
  • Layer 1-48 Layers
  • Solder Mask Color Green/Black/Red/Blue/Yellow/White/
  • Shipping DHL, FedEx, UPS
  • Copper Thickness 0.5oz-6oz
  • Min. Order Quantity 5 Pieces
  • Max. Pth/Npth Size Pth:6.35mm Npth: 6.35mm
  • Min.Hole Size Pth : 0.1mm Npth : 0.2mm
  • Tolerance +/-0.075mm

Product Description

About Company Our company has nearly 120 employees, more than 25 engineerings and quality personnel 24 hours a day to provide professional PCBA production services for customers around the world, 5 automatic SMT placement production lines, 2 DIP wave production line, 1 assembly line after ...

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PCB Circuit Board Comparison
Transaction Info
Price US $ 0.30-0.68/ Piece US $ 0.67-4.90/ Piece US $ 2.39-4.75/ Piece US $ 0.48-3.20/ Piece US $ 0.715-5.40/ Piece
Min Order 5 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Payment Terms T/T, D/P, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 9000, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$2.5 Million - US$5 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: one month
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Turnkey Service: PCB Manufacturing +Purchase Components+Assembly;
Layer: 1-48 Layers;
Solder Mask Color: Green/Black/Red/Blue/Yellow/White/;
Shipping: DHL, FedEx, UPS;
Copper Thickness: 0.5oz-6oz;
Min. Order Quantity: 5 Pieces;
Max. Pth/Npth Size: Pth:6.35mm Npth: 6.35mm;
Min.Hole Size: Pth : 0.1mm Npth : 0.2mm;
Tolerance: +/-0.075mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Indutrial/Power Supply;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Other: Tg180;
Pad in Via: 0.2mm;
BGA to Line: 3mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 10L;
Min. Hole to Line: 7mil;
BGA to Line: 3mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Inner Min. Hole to Line: 8.5mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Min. Hole to Line: 7.8mil;
Surface Finish: Plated Gold 40u;
Min. Trace Line&Space: 3/3mil;
Supplier Name

ShenZhen BeiGao Electronic Co.,Ltd

Gold Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier