High Tg Fr-4 PCB Built on 4 Layer with Bare Board Testing

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology HASL
  • Base Material Copper Clad Laminate
  • Insulation Materials Epoxy Resin
  • Brand Bicheng
  • Transport Package Vacuum
  • Specification 156 X 180mm
  • Trademark Bicheng
  • Origin China

Product Description

General Profile Today the workhorse of the PCB fabrication industry is epoxy glass FR-4 grade, a material based on an epoxy resin system. It begins to soften at a temperature of 130° C (glass transition temperature, Tg) and exhibits a high expansion in the Z-axis direction when heated above ...

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Transaction Info
Price US $ 9.99/ Piece US $ 0.10-3.00/ Piece US $ 0.01-15.00/ Piece US $ 0.01-150.00/ Piece US $ 0.10-10.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal
Quality Control
Product Certification - - - - UL, ISO9001&ISO14001, SGS, RoHS Report
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM, Own Brand(Bicheng) OEM OEM OEM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Copper Clad Laminate;
Insulation Materials: Epoxy Resin;
Brand: Bicheng;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green / Blue;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 1.8mm / Custom;
Custom: OEM;
Copper: 1oz / 1.5oz / 2oz;
Surface Finish: Enig;
Layers: 6 Layers;
Holes Specification: Buried/Blind Vias, Via in Pads;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: PCB Board;
Layer: 4;
Surface Finish: Enig;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier