Blind Via PCB Built Tg170º C Fr-4 with 4 Layers Copper

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.40 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum
  • Specification 175 x 200mm=30PCS
  • Trademark Bicheng Enterprise Limited
  • Origin China
  • Final Foil External 1 Oz
  • Final Foil Internal 1 Oz
  • Final Height of PCB 1.6mm
  • Surface Finish Immersion Gold
  • Solder Mask Color Green
  • Colour of Component Legend White
  • Minimum Trace and Space 7.9 Mil / 5.9 Mil
  • Minimum / Maximum Holes 0.3 mm / 0.5 mm
  • Via Blind Via L1-L2, Minimum Size 0.3mm
  • Test 100% Electrical Test

Product Description

1.1 General description This is a type of 4 layer PCB built on FR-4 substrate with Tg 170°C for the application of GPS Locator. It's 1.60 mm thick with blind via from top layer to first inner layer.Green solder mask covers both sides and immersion gold are on pads. The base material is used ...

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PCB Board Comparison
Transaction Info
Price US $ 0.4/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.70-3.70/ PCS US $ 1.20-2.00/ PCS
Min Order 1 Pieces 1 Pieces 1 Pieces 1 PCS 1 PCS
Payment Terms T/T, Western Union, Paypal T/T T/T L/C, T/T, Western Union L/C, T/T, Western Union
Quality Control
Product Certification - - - ISO, UL, RoHS,CE,IATF ISO, UL, RoHS,CE,IATF
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Mid East, Western Europe North America, Eastern Europe, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$2.5 Million - US$5 Million US$2.5 Million - US$5 Million Above US$100 Million Above US$100 Million
Business Model OEM, Own Brand(Bicheng) OEM, ODM OEM, ODM OEM OEM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
- - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Final Foil External: 1 Oz;
Final Foil Internal: 1 Oz;
Final Height of PCB: 1.6mm;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Space: 7.9 Mil / 5.9 Mil;
Minimum / Maximum Holes: 0.3 mm / 0.5 mm;
Via: Blind Via L1-L2, Minimum Size 0.3mm;
Test: 100% Electrical Test;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Max Layer Counts: 6 Layer;
Max Copper Thickness: 2oz;
Mininum Line Width: 3mil;
Minimum Line Space: 3mil;
UL Certificate: Yes;
Sample Building: Yes;
Quickturn Service: Yes;
Country of Origin: China;
Packing: Vacuum Packing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green/Yellow/Black/White/Red/Blue;
Number of Layers: Multilayer;
Copper Thickness: 0.5-7.0oz;
Condition: Original Made;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green/Yellow/Black/White/Red/Blue;
Number of Layers: Multilayer;
Copper Thickness: 0.5-7.0oz;
Condition: Original Made;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Shenzhen Greenstone Technology Limited

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier