Buried Via PCB  Built on 26 Layer with Immersion Gold

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Enig
  • Base Material Copper Clad Laminate
  • Insulation Materials Epoxy Resin
  • Brand Bicheng
  • Transport Package Vacuum
  • Specification 220 X 220mm
  • Trademark Bicheng
  • Origin China

Product Description

General profile The buried via is the hole made between inner layers used to interconnect the inner layer signal. It can not be visible from surface layers of top and bottom layer. Generally, they're often used on the mobile phone, PDA board etc. Advantages A) Reduce the probability of ...

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Prototype Comparison
Transaction Info
Price US $ 9.99/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 2.30-4.30/ PCS US $ 0.10-10.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 PCS 1 Pieces
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Western Union L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - - - ISO, UL, RoHS, CE -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Trade Capacity
Export Markets North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue US$10 Million - US$50 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, Own Brand(Bicheng) OEM, ODM, Own Brand() OEM, ODM, Own Brand() OEM OEM, ODM, Own Brand()
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Copper Clad Laminate;
Insulation Materials: Epoxy Resin;
Brand: Bicheng;
Type: Rigid Circuit Board;
Dielectric: Ecx-3;
Material: Ecx-3c;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig/HASL/OSP;
Base Material: Fr4 Hi Tg;
Insulation Materials: Metal Composite Materials;
Brand: Item;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Type: Rigid Circuit Board;
Dielectric: Fr4;
Material: Fr4;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig/HASL/OSP;
Base Material: Fr4 Hi Tg;
Insulation Materials: Metal Composite Materials;
Brand: Item;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
Type: Rigid Circuit Board;
Dielectric: Fr4;
Material: Fr4;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig/HASL/OSP;
Base Material: Fr4 Hi Tg;
Insulation Materials: Metal Composite Materials;
Brand: Item;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier