No Silkscreen Multilayer PCB Board Red Soldermask with OSP Surface

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.63 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum
  • Specification 290.00x 150.00mm=1PCS
  • Trademark Bicheng Enterprise Limited
  • Origin China
  • Outer Copper Foil 1oz
  • Board Thickness 1.85-1.92mm
  • Surface Treament OSP
  • Solder Mask Red, Psr-2000gt 600d
  • Legend White, Ijr-4000 MW300
  • Min Line Width (Mil) 5.7
  • Min Line Spacing (Mil) 5
  • Electrical Test 100% PCB Passed
  • Warp-Twist 0.19%
  • Solderability Test 245ºC 5s 1 Cycle

Product Description

Warpage less than 0.19% Prototype PCB FR-4 8 Layerwith Red Solder Mask and OSP in Car Amplifier Commodity Introduction This is a type of FR-4 PCB for the application of . It's an 8 layer board at 1.85-1.92mm thick. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. ...

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Transaction Info
Price US $ 0.63/ Piece US $ 0.10-1.50/ Piece US $ 0.10-1.50/ Piece US $ 0.10-1.50/ Piece US $ 0.10-1.50/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001
Trade Capacity
Export Markets North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe
Annual Export Revenue US$10 Million - US$50 Million Above US$100 Million Above US$100 Million Above US$100 Million Above US$100 Million
Business Model OEM, Own Brand(Bicheng) OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Outer Copper Foil: 1oz;
Board Thickness: 1.85-1.92mm;
Surface Treament: OSP;
Solder Mask: Red, Psr-2000gt 600d;
Legend: White, Ijr-4000 MW300;
Min Line Width (Mil): 5.7;
Min Line Spacing (Mil): 5;
Electrical Test: 100% PCB Passed;
Warp-Twist: 0.19%;
Solderability Test: 245ºC 5s 1 Cycle;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier