Electronics PCB Board RO4003c 0.8mm Thick Printed Circuit Board Design

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Price

Min. Order Reference FOB Price

1 Piece US$1.21 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric RO4003c 32 Mil 0.813mm
Material Hydrocarbon/Woven Glass
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Glass Reinforced Hydrocarbon
Transport Package Vacuun
Specification 76 x 52mm=1PCS
Trademark Bicheng Enterprise Limited
Origin China
Final Foil External 1.5 Oz
Surface Finish HASL, Lead Free
Final Height of PCB 0.8mm
Solder Mask Color Green
Colour of Component Legend White
Minimum Trace and Space 5.7 Mil/6.8 Mil
Minimum / Maximum Holes 0.45/6.6mm
Via Plated Through Hole(Pth)
Board Plating 0.0030"
Test 100% Electrical Test

Product Description

Electronics Microwave High Frequency printed Circuit Board RO4003C 32mil Green Solder Mask PCB Board Applied In Relay Station design Commodity Introduction This is a type of RO4003C PCB for the application of Relay Station. It's a 2 layer board at 0.8mm thick. The base laminate is from ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Business Type Trading Company
Main Products PCB, High Frequency PCB, Metal Core PCB, Aluminum PCB, Prototype PCB, Multilayer PCB, Flexible Printed Circuit FPC, Double Sided PCB
Number of Employees 9
Year of Establishment 2020-01-20
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays, one month

PCB Comparison

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Transaction Info
	Electronics PCB Board RO4003c 0.8mm Thick Printed Circuit Board Design Contact Now	Quick View UL Fr4 High Tg 94V0 6 Layers PCB Circuit Board Printing & PCBA Service Contact Now	Quick View Enig 2u" Multilayer PCB Printed Circuit Boards Made of RoHS 94V0 Fr4 in Green Ink Contact Now	Quick View Multilayer Gold Finger PCB Mobilephone Mother Board with Big BGA Contact Now	Quick View HDI PCB Circuit Board Made of Fr4+Rogers with Enig Finish for Bonding Contact Now
Price	US $ 1.21/ Piece	US $ 0.01-10.00/ Piece	US $ 0.01-100.00/ Piece	US $ 0.01-60.00/ Piece	US $ 0.01-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, Western Union	T/T, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net
Quality Control
Product Certification	-	RoHS, ISO14000, ISO9001, UL	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, Own Brand(Bicheng)	OEM	OEM	OEM	OEM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: RO4003c 32 Mil 0.813mm; Material: Hydrocarbon/Woven Glass; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Glass Reinforced Hydrocarbon; Final Foil External: 1.5 Oz; Surface Finish: HASL, Lead Free; Final Height of PCB: 0.8mm; Solder Mask Color: Green; Colour of Component Legend: White; Minimum Trace and Space: 5.7 Mil/6.8 Mil; Minimum / Maximum Holes: 0.45/6.6mm; Via: Plated Through Hole(Pth); Board Plating: 0.0030"; Test: 100% Electrical Test;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layer: 1-20 Layer; Board Thickness: 0.4-2.0mm; Surface Finish: HASL, Enig, OSP, Gold Finger; Copper Thickness: 18um-175um; Solder Mask: Red, Green, Blue, Yellow, Black, White...;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Fr4; Brand: Abis; Layer: 4 Layers; Board Thickness: 2.0mm; Surface Finish: Enig 2 U"; Raw Material: Fr4; Outer Copper Thickness: 35um; Inner Copper Thickness: 70un; Solder Mask: Green; Legend: White;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Abis; Layer: 6 Layer; Board Thickness: 2.0mm; Surface Finish: Enig, Gold Finger; Copper Thickness: 70um; Solder Mask: Green; Legend: White;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layer: 1-20 Layers; Board Thickness: 0.2-6mm; Surface Finish: Lf-HASL, Enig, OSP, Immersion Silver etc; Impedance Control Tolerance: +/- 10%; Mini Hole Size: 0.1mm; Mini Line Width: 0.1mm;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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