| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Copper Clad Laminate;
Insulation Materials: Epoxy Resin;
Brand: Bicheng;
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Type: Rigid Circuit Board;
Dielectric: Rogers;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: EEG;
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Type: Rigid Circuit Board;
Dielectric: Rogers;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Price: Factory Price;
Keyword: Custom PCB;
Product Name: High Frequency Board;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Copper Thickness: 0.5-12oz(18-420um);
Min. Line Spacing: 0.075mm(3mil);
Board Thickness: 0.2-6.0mm;
Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free;
Service: One-Stop Service, PCB Assembly, Component Supply;
Testing Service: 100% E-Testing;
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Type: Rigid Circuit Board;
Dielectric: Rogers;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Price: Factory Price;
Keyword: Custom PCB;
Product Name: High Frequency Board;
MOQ: 1 PCS;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Copper Thickness: 0.5-12oz(18-420um);
Min. Line Spacing: 0.075mm(3mil);
Board Thickness: 0.2-6.0mm;
Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free;
Service: One-Stop Service, PCB Assembly, Component Supply;
Testing Service: 100% E-Testing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
MOQ: 1 PCS;
Min. Line Spacing: 0.075mm(3mil);
Copper Thickness: 18um-3500um(0.5- 100oz);
Min. Line Width: 0.075mm(3mil);
Min Hole Size: 0.1mm(4mil);
Testing Service: 100% E-Testing;
Board Thickness: 0.2-6.0mm;
Industrial: Industrial Control Board, Motherboard;
Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger.OSP;
Solder Mask: Green, White, Black, Blue, Red(Customized);
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