Specification |
Type: Rigid Circuit Board;
Dielectric: CEM-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lead-Free;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Material Type: Fr4,High Tg,Cem1,Cem3,Aluminiaum Base,Arlon,Roger;
Layer Counts: 1--30;
Board Thickness: 0.2mm--6.0mm;
Fished Outer Copper: 1oz--5oz;
Minimum Trace Width: 0.003'';
Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: UC;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: 2 Layer;
Copper Thickness: 1oz;
Condition: Original Made;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Uc;
Copper Thickness: 2oz;
Surface Finishing: Immersion Gold PCB;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width/Space: 0.1mm;
Test: Flying Probe and Fixture;
Certificates: UL, ISO, RoHS, Ts;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Uc;
Copper Thickness: 2oz;
Surface Finishing: Immersion Gold PCB;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width/Space: 0.1mm;
Test: Flying Probe and Fixture;
Certificates: UL, ISO, RoHS, Ts;
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