BGA PCB Circuit Board Built on 10 Layer with UL Certified

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Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Enig
Base Material Copper Clad Laminate
Insulation Materials Epoxy Resin
Brand Bicheng
Transport Package Vacuum
Specification 110 X 100mm
Trademark Bicheng
Origin China

Product Description

General profile BGA is ball grid array packaging technology, high density surface assembly packaging technology. At the bottom of the package, the pins are spherical and arranged into a lattice-like pattern, hence name BGA. It's a type of surface-mount packaging used for integrated circuits(IC). ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Business Type Trading Company
Main Products PCB, High Frequency PCB, Metal Core PCB, Aluminum PCB, Prototype PCB, Multilayer PCB, Flexible Printed Circuit FPC, Double Sided PCB
Number of Employees 9
Year of Establishment 2020-01-20
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays, one month

Prototype Comparison

	BGA PCB Circuit Board Built on 10 Layer with UL Certified Contact Now	Spot Inventory Genuine Original Packaging Stm32f103c8t6 Electronic Components IC Chip Transistor Contact Now	Multilayer Fr4 PCB Printed Circuit Board Motherboard PCB Assembly HDI PCB Design PCBA for Electronics Contact Now	Electronics- New and Original Good Quality DIP-8 Lm311p Lm311 Voltage Comparators IC Contact Now	Quick View Custom Medical PCBA One Stop Service Other PCB Circuit Boards SMT PCB Manufacturing and PCB Assembly Factory Contact Now

Transaction Info
	BGA PCB Circuit Board Built on 10 Layer with UL Certified Contact Now	Spot Inventory Genuine Original Packaging Stm32f103c8t6 Electronic Components IC Chip Transistor Contact Now	Multilayer Fr4 PCB Printed Circuit Board Motherboard PCB Assembly HDI PCB Design PCBA for Electronics Contact Now	Electronics- New and Original Good Quality DIP-8 Lm311p Lm311 Voltage Comparators IC Contact Now	Quick View Custom Medical PCBA One Stop Service Other PCB Circuit Boards SMT PCB Manufacturing and PCB Assembly Factory Contact Now
Price	US $ 9.99/ Piece	US $ 0.10-1.89/ Piece	US $ 0.10-3.00/ Piece	US $ 0.10-2.30/ Piece	US $ 2.00-8.00/ Piece
Min Order	1 Pieces	1 Pieces	2 Pieces	1 Pieces	2 Pieces
Payment Terms	T/T, Western Union, Paypal	T/T, D/P, Western Union, Paypal	T/T, D/P, Western Union, Paypal	T/T, D/P, Western Union, Paypal	T/T, D/P, Western Union
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949
Trade Capacity
Export Markets	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million	US$1 Million - US$2.5 Million
Business Model	OEM, Own Brand(Bicheng)	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;	Type: Rigid Circuit Board; Dielectric: CEM-3; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: New Chip; Soldermask Color: Green, Yellow, Blue, Black, White...; Sample: Available; OEM/ODM: Available; Certificate Gurantee: Yes; Test: 100%E-Testing; Color of Silk Screen: Green, Purple, Black; Service: OEM / Dfm;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
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