Gold Finger PCB Built on 20 Layer with Thermal Stress Test

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Enig
Base Material Copper Clad Laminate
Insulation Materials Epoxy Resin
Brand Bicheng
Transport Package Vacuum
Specification 131 X 98mm
Trademark Bicheng
Origin China

Product Description

General Profile The gold finger (connecting finger) is a connecting part between the memory bank and the memory slot. All signals are transmitted through the gold fingers. The gold finger is made up of a number of golden conductive contacts, which are called "gold fingers" because their surfaces ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Business Type Trading Company
Main Products PCB, High Frequency PCB, Metal Core PCB, Aluminum PCB, Prototype PCB, Multilayer PCB, Flexible Printed Circuit FPC, Double Sided PCB
Number of Employees 9
Year of Establishment 2020-01-20
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays, one month

Blind Via PCB Comparison

	Gold Finger PCB Built on 20 Layer with Thermal Stress Test Contact Now	Mustar PCBA Manufacturer PCB Prototype Fabrication Soldering Factory in Shenzhen Contact Now	Quick View PCB Assembly and PCBA Manufacturer Services Other PCB & PCBA Contact Now	Electronic Multilayer PCB & PCBA Fabrication SMD PCB Assembly Process Contact Now	Quick View Mini Dual Band WiFi Router PCB Industrial Built-in Ethernet WiFi Router Module/Board Contact Now

Transaction Info
	Gold Finger PCB Built on 20 Layer with Thermal Stress Test Contact Now	Mustar PCBA Manufacturer PCB Prototype Fabrication Soldering Factory in Shenzhen Contact Now	Quick View PCB Assembly and PCBA Manufacturer Services Other PCB & PCBA Contact Now	Electronic Multilayer PCB & PCBA Fabrication SMD PCB Assembly Process Contact Now	Quick View Mini Dual Band WiFi Router PCB Industrial Built-in Ethernet WiFi Router Module/Board Contact Now
Price	US $ 9.99/ Piece	US $ 2.68-5.60/ Piece	US $ 0.01-2.00/ Piece	US $ 2.68-5.60/ Piece	US $ 0.20-2.60/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay	T/T, D/P, Western Union	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay	T/T, D/P, Western Union
Quality Control
Product Certification	-	RoHS/ISO9001/Ts16949/ISO14001/ISO13485	-	RoHS/ISO9001/Ts16949/ISO14001/ISO13485	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, IATF16949	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, IATF16949
Trade Capacity
Export Markets	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	-	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	-	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	Above US$100 Million	US$1 Million - US$2.5 Million	Above US$100 Million	US$1 Million - US$2.5 Million
Business Model	OEM, Own Brand(Bicheng)	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mustar; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: New Chip; Soldermask Color: Green, Yellow, Blue, Black, White...; Sample: Available; OEM/ODM: Available; Certificate Gurantee: Yes; Test: 100%E-Testing; Color of Silk Screen: Green, Purple, Black; Service: OEM / Dfm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mustar; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Mu Star (shenzhen) Industry Co., Ltd.	Shenzhen New Chip international Ltd	Mu Star (shenzhen) Industry Co., Ltd.	Shenzhen New Chip international Ltd
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