10 Layer PCB Single-End / Differential Impedance Control

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Price

Min. Order Reference FOB Price

1 Piece US$0.57 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum
Specification 199mm x 170mm =4pcs
Trademark Bicheng Enterprise Limited
Origin China
Board Thick 1.6mm
Surface Finish Immersion Gold
out Layer Copper 1 Oz
Final Foil Internal 1 Oz
Soldermask Color Green
Silkscreen Color White
Minimum Trace and Space 4 Mil / 4 Mil
Minimum / Maximum Holes 0.25/4.2mm
Impedance Control 50 Ohms Single End
Test 100% Electronic Test

Product Description

1.1 General description This is a type of multilayer PCB built on FR-4 substrate with Tg 170°C for the application of Satellite systems with 10 layer copper. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. This is also an impedance ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Business Type Trading Company
Main Products PCB, High Frequency PCB, Metal Core PCB, Aluminum PCB, Prototype PCB, Multilayer PCB, Flexible Printed Circuit FPC, Double Sided PCB
Number of Employees 9
Year of Establishment 2020-01-20
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays, one month

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Transaction Info
	10 Layer PCB Single-End / Differential Impedance Control Contact Now	Quick View China Professional PCB Manufacturer PCBA Board PCBA Factory PCB Supplier PCBA Production Contact Now	Quick View PCBA Assembly PCB Fabrication Printed Circuit Board Electronics Motherboard PCBA Production Contact Now	Quick View BMS Motherboard and Other Types of Circuit Board PCB Processing Assembly Design PCBA Production Contact Now	Quick View Cheap and High Quality Multilayer PCBA High Standard Professional Circuit Board PCB Assembly Manufacturing PCBA Production Contact Now
Price	US $ 0.57/ Piece	US $ 0.10-1.50/ Piece	US $ 0.10-1.50/ Piece	US $ 0.10-1.50/ Piece	US $ 0.10-1.50/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million
Business Model	OEM, Own Brand(Bicheng)	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Board Thick: 1.6mm; Surface Finish: Immersion Gold; out Layer Copper: 1 Oz; Final Foil Internal: 1 Oz; Soldermask Color: Green; Silkscreen Color: White; Minimum Trace and Space: 4 Mil / 4 Mil; Minimum / Maximum Holes: 0.25/4.2mm; Impedance Control: 50 Ohms Single End; Test: 100% Electronic Test;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Kevis; Layer: 1-64 Layers; Board Thickness: 0.2mm-7.0mm; Min. Line Width: 0.075mm/0.075mm(3mil/3mil); Min. Hole Size: 0.15mm; Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold; Solder Mask Color: Green, Blue, Yellow, White, Black;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Kevis; Layer: 1-64 Layers; Board Thickness: 0.2mm-7.0mm; Min. Line Width: 0.075mm/0.075mm(3mil/3mil); Min. Hole Size: 0.15mm; Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold; Solder Mask Color: Green, Blue, Yellow, White, Black;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Kevis; Layer: 1-64 Layers; Board Thickness: 0.2mm-7.0mm; Min. Line Width: 0.075mm/0.075mm(3mil/3mil); Min. Hole Size: 0.15mm; Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold; Solder Mask Color: Green, Blue, Yellow, White, Black;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Kevis; Layer: 1-64 Layers; Board Thickness: 0.2mm-7.0mm; Min. Line Width: 0.075mm/0.075mm(3mil/3mil); Min. Hole Size: 0.15mm; Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold; Solder Mask Color: Green, Blue, Yellow, White, Black;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Guangzhou Kevis Electronic Technology Co., Ltd.	Guangzhou Kevis Electronic Technology Co., Ltd.	Guangzhou Kevis Electronic Technology Co., Ltd.	Guangzhou Kevis Electronic Technology Co., Ltd.
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