Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Copper Clad Laminate;
Insulation Materials: Epoxy Resin;
Brand: Bicheng;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industry Control;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yizexin;
Color: According to Your Design;
Feature: Enclosed and Waterproof;
Insulation Ink Voltage: 100VDC;
Custom Made: OEM/Customize;
Conductive Ink: Screen Printing Silver Ink, Carbon Ink;
Pattern of Payment: L/C, T/T, Dp, Western Union, Paypal, Money Gram;
Package: Inner; Vacuum Packing; Dry Packing out Packing;
Back Adhesive: 3m9449 3m467 3m468 3m200;
Transportation: by Ship/by Air/by Land;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industry Control;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yizexin;
Color: According to Your Design;
Feature: Enclosed and Waterproof;
Insulation Ink Voltage: 100VDC;
Custom Made: OEM/Customize;
Conductive Ink: Screen Printing Silver Ink, Carbon Ink;
Pattern of Payment: L/C, T/T, Dp, Western Union, Paypal, Money Gram;
Package: Inner; Vacuum Packing; Dry Packing out Packing;
Back Adhesive: 3m9449 3m467 3m468 3m200;
Transportation: by Ship/by Air/by Land;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Turnkey GPS Tracker Printed Circuit Board Assembly;
Layer: 1-18;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Service: Aging Function Test;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Layer: 1-18;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Service: Aging Function Test;
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