Multilayer PCB Built on Fr4 with 6 Layer Copper Layer

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Price

Min. Order Reference FOB Price

1 Piece US$0.89 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum
Specification 135mm x 91mm =2pcs
Trademark Bicheng Enterprise Limited
Origin China
Board Thick 1.6mm
Surface Finish HASL Lead Free
out Layer Copper 1 Oz
Soldermask Color Green
Silkscreen Color White
Minimum Trace and Space 4 Mil / 4 Mil
Minimum / Maximum Holes 0.3/4.22mm
Final Foil Internal 1 Oz
Via Minimum Size 0.3mm
Test 100% Electronic Test

Product Description

1.1 General description This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of Fiber optic receptors. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and HASL on pads. The base material is from ITEQ supplying 2 up PCBs per ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Business Type Trading Company
Main Products PCB, High Frequency PCB, Metal Core PCB, Aluminum PCB, Prototype PCB, Multilayer PCB, Flexible Printed Circuit FPC, Double Sided PCB
Number of Employees 9
Year of Establishment 2020-01-20
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays, one month

PCB Board Comparison

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Transaction Info
	Multilayer PCB Built on Fr4 with 6 Layer Copper Layer Contact Now	Quick View PCBA R&D Manufacture Electric Oven Control Panel Oven Circuit Board with One- Stop SMT DIP Services Contact Now	Quick View Multilayer PCBA Contract Manufacturing Printed Circuit Board Assembly for Bluetooth Speaker Contact Now	Quick View Trusted Valued PCBA Factory PCB Assembly with ISO9001 ISO13485 IATF16949 Certificate Contact Now	Quick View Quick - Turn Manufacturing PCB Assembly IoT - Enabled PCBA for Connected Devices Contact Now
Price	US $ 0.89/ Piece	US $ 0.98-5.00/ Piece	US $ 0.15-10.00/ Piece	US $ 0.87-5.00/ Piece	US $ 0.15-4.80/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Payment Terms	T/T, Western Union, Paypal	T/T	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe	North America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe
Annual Export Revenue	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million	US$10 Million - US$50 Million
Business Model	OEM, Own Brand(Bicheng)	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months	Off Season Lead Time: one month Peak Season Lead Time: 1-3 months
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Board Thick: 1.6mm; Surface Finish: HASL Lead Free; out Layer Copper: 1 Oz; Soldermask Color: Green; Silkscreen Color: White; Minimum Trace and Space: 4 Mil / 4 Mil; Minimum / Maximum Holes: 0.3/4.22mm; Final Foil Internal: 1 Oz; Via: Minimum Size 0.3mm; Test: 100% Electronic Test;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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