Specification |
Type: Rigid Circuit Board;
Dielectric: RF-10;
Material: Ceramic Filled PTFE and Woven Fiberglass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Thickness: 10mil, 20mil, 60mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Application: RF Applications;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL Lf, Plating. Gold, Immersion Gold, Silver;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Shengyi, Kb, Nanya, Ilm;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 3mil/4mil;
Soldermask: Green, Blue, White, Black, Yellow, Red;
Silkscreen: White, Black, Blue, Yellow;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
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