Custom OEM HDI Multilayer PCB Board 94V0 Electronics Printed PCB Circuits Board PCBA Assembly Manufacturer Supplier

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10000 Meters US$0.08 / Meter

Sepcifications

  • Type Flexible Circuit Board
  • Dielectric FR-4
  • Material Polyimide
  • Flame Retardant Properties V0
  • Mechanical Rigid Fexible
  • Processing Technology Electrolytic Foil
  • Base Material Polyimide
  • Insulation Materials Epoxy Resin
  • Model PCB
  • Brand Jointek
  • Transport Package Carton + Pallet
  • Specification 100m
  • Trademark JOINTEK
  • Origin China
  • Copper Weight 18/25um, 18/35um, 35/35um, 18/50um, 18/70um, 70/70
  • Surface Treatment OSP
  • Substrate Pi or Pet
  • Delivery Spec 100m, 200m, 300m Per Roll
  • Soldermask Color White, Black, Red, Yellow, Gold etc
  • Thickness 0.1~0.3mm

Product Description

Custom oem hdi multilayer pcb board 94v0 electronics printed pcb circuits board pcba assembly manufacturer supplier Features: 1. Length, Width and panel array, Copper weight can be customized as per client's requirement, Up to 300m/roll; 2. High temperature Polyimide PI type or low temperature ...

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Multilayer PCB Comparison
Transaction Info
Price US $ 0.08/ Meter US $ 0.10-100.00/ Piece US $ 2.85-3.00/ Piece US $ 0.10-100.00/ Piece US $ 0.10-100.00/ Piece
Min Order 10000 Meters 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union L/C, T/T, D/P T/T L/C, T/T, D/P L/C, T/T, D/P
Quality Control
Product Certification - RoHS, UL, ISO - RoHS, UL, ISO RoHS, UL, ISO
Management System Certification ISO 9001, ISO 14001 - ISO 9001, ISO 14001, IATF16949 - -
Trade Capacity
Export Markets North America, South America, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Europe, Southeast Asia/ Mideast, Africa, Domestic - South America, Europe, Southeast Asia/ Mideast, Africa, Domestic South America, Europe, Southeast Asia/ Mideast, Africa, Domestic
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand - OEM, ODM - -
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1-3 Month(s)
- - - -
Product Attributes
Specification
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Polyimide;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Jointek;
Copper Weight: 18/25um, 18/35um, 35/35um, 18/50um, 18/70um, 70/70;
Surface Treatment: OSP;
Substrate: Pi or Pet;
Delivery Spec: 100m, 200m, 300m Per Roll;
Soldermask Color: White, Black, Red, Yellow, Gold etc;
Thickness: 0.1~0.3mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yldz;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: HASL;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
Supplier Name

ZHUHAI BOMIN SOLAR TECHNOLOGY CO., LTD.

China Supplier - Gold Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier

Wenzhou Yongli Electronics Co, . Ltd

China Supplier - Diamond Member Audited Supplier